Universal ultrasound device and related apparatus and methods

ABSTRACT

A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a continuation claiming the benefit under 35 U.S.C.§ 120 of U.S. application Ser. No. 15/626,711, entitled “UNIVERSALULTRASOUND DEVICE AND RELATED APPARATUS AND METHODS,” filed on Jun. 19,2017 under Attorney Docket No. B1348.70030US02 which is herebyincorporated herein by reference in its entirety.

U.S. application Ser. No. 15/626,711 claims the benefit under 35 U.S.C.§ 119(e) of U.S. Provisional Application Ser. No. 62/352,337, entitled“UNIVERSAL ULTRASOUND DEVICE AND RELATED APPARATUS AND METHODS,” filedon Jun. 20, 2016 under Attorney Docket No. B1348.70030US00, which ishereby incorporated herein by reference in its entirety.

U.S. application Ser. No. 15/626,711 is a continuation-in-part claimingthe benefit under 35 U.S.C. § 120 of U.S. application Ser. No.15/415,434, entitled “UNIVERSAL ULTRASOUND DEVICE AND RELATED APPARATUSAND METHODS,” filed on Jan. 25, 2017 under Attorney Docket No.B1348.70030US01, which claims the benefit under 35 U.S.C. § 119(e) ofU.S. Provisional Application Ser. No. 62/352,337, entitled “UNIVERSALULTRASOUND DEVICE AND RELATED APPARATUS AND METHODS,” filed on Jun. 20,2016 under Attorney Docket No. B1348.70030US00, each of which is herebyincorporated herein by reference in its entirety.

FIELD

The present application relates to an ultrasound device that can operateacross multiple different frequency ranges to obtain high-resolutionimages of a subject at different depths.

BACKGROUND

Ultrasound imaging systems typically include an ultrasound probeconnected to a host by an analog cable. The ultrasound probe iscontrolled by the host to emit and receive ultrasound signals. Thereceived ultrasound signals are processed to generate an ultrasoundimage.

SUMMARY

Some embodiments are directed to an ultrasound device including anultrasound probe, including a semiconductor die, and a plurality ofultrasonic transducers integrated on the semiconductor die, theplurality of ultrasonic transducers configured to operate in a firstmode associated with a first frequency range and a second modeassociated with a second frequency range, wherein the first frequencyrange is at least partially non-overlapping with the second frequencyrange; and control circuitry configured to: control the plurality ofultrasonic transducers to generate and/or detect ultrasound signalshaving frequencies in the first frequency range, in response toreceiving an indication to operate the ultrasound probe in the firstmode; and control the plurality of ultrasonic transducers to generateand/or detect ultrasound signals having frequencies in the secondfrequency range, in response to receiving an indication to operate theultrasound probe in the second mode.

Some embodiments are directed to a system, comprising: a multi-modalultrasound probe (e.g., a hand-held multi-modal ultrasound probe)configured to operate in a plurality of operating modes associated witha respective plurality of configuration profiles; and a computing device(e.g., a mobile computing device) coupled to the multi-modal ultrasoundprobe and configured to, in response to receiving input indicating anoperating mode selected by a user, cause the multi-modal ultrasoundprobe to operate in the selected operating mode.

Some embodiments are directed to a method for controlling operation of amulti-modal ultrasound probe configured to operate in a plurality ofoperating modes associated with a respective plurality of configurationprofiles, the method comprising: receiving, at a computing device, inputindicating an operating mode selected by a user; and causing themulti-modal ultrasound probe to operate in the selected operating modeusing parameter values specified by a configuration profile associatedwith the selected operating mode.

Some embodiments are directed to a system, comprising: an ultrasounddevice, comprising: a plurality of ultrasonic transducers, and controlcircuitry; and a computing device having at least one computer hardwareprocessor and at least one memory, the computing device communicativelycoupled to a display and to the ultrasound device, the at least onecomputer hardware processor configured to: present, via the display, agraphical user interface (GUI) showing a plurality of GUI elementsrepresenting a respective plurality of operating modes for theultrasound device, the plurality of operating modes comprising first andsecond operating modes; responsive to receiving, via the GUI, inputindicating selection of either the first operating mode or the secondoperating mode, provide an indication of the selected operating mode tothe ultrasound device, wherein the control circuitry is configured to:responsive to receiving an indication of the first operating mode,obtain a first configuration profile specifying a first set of parametervalues associated with the first operating mode; and control, using thefirst configuration profile, the ultrasound device to operate in thefirst operating mode, and responsive to receiving an indication of thesecond operating mode, obtain a second configuration profile specifyinga second set of parameter values associated with the second operatingmode, the second set of parameter values being different from the firstset of parameter values; and control, using the second configurationprofile, the ultrasound device to operate in the second operating mode.

Some embodiments are directed to a method, comprising: receiving, via agraphical user interface, a selection of an operating mode for anultrasound device configured to operate in a plurality of modesincluding a first operating mode and a second operating mode; responsiveto receiving a selection of a first operating mode, obtaining a firstconfiguration profile specifying a first set of parameter valuesassociated with the first operating mode; and controlling, using thefirst configuration profile, the ultrasound device to operate in thefirst operating mode, and responsive to receiving a selection of thesecond operating mode, obtaining a second configuration profilespecifying a second set of parameter values associated with the secondoperating mode, the second set of parameter values being different fromthe first set of parameter values; and controlling, using the secondconfiguration profile, the ultrasound device to operate in the secondoperating mode.

Some embodiments are directed to a handheld multi-modal ultrasound probeconfigured to operate in a plurality of operating modes associated witha respective plurality of configuration profiles, the handheldultrasound probe comprising: a plurality of ultrasonic transducers; andcontrol circuitry configured to: receive an indication of a selectedoperating mode; access a configuration profile associated with theselected operating mode; and control, using parameter values specifiedin the accessed configuration profile, the handheld multi-modalultrasound probe to operate in the selected operating mode.

Some embodiments are directed to an ultrasound device capable ofoperating in a plurality of operating modes including a first operatingmode and a second operating mode, the ultrasound device comprising: aplurality of ultrasonic transducers, and control circuitry configuredto: receive an indication of a selected operating mode; responsive todetermining that the selecting operating mode is the first operatingmode, obtain a first configuration profile specifying a first set ofparameter values associated with the first operating mode; and control,using the first configuration profile, the ultrasound device to operatein the first operating mode, and responsive to receiving an indicationof the second operating mode, responsive to determining that theselecting operating mode is the second operating mode, obtain a secondconfiguration profile specifying a second set of parameter valuesassociated with the second operating mode, the second set of parametervalues being different from the first set of parameter values; andcontrol, using the second configuration profile, the ultrasound deviceto operate in the second operating mode.

Some embodiments are directed to a mobile computing devicecommunicatively coupled to an ultrasound device, the mobile computingdevice comprising: at least one computer hardware processor; a display;and at least one non-transitory computer-readable storage medium storingan application program that, when executed by the at least one computerhardware processor causes the at least one computer hardware processorto: generate a graphical user interface (GUI) having a plurality of GUIelements representing a respective plurality of operating modes for themulti-modal ultrasound device; present the GUI via the display; receive,via the GUI, user input indicating selection of one of the plurality ofoperating modes; and provide an indication of the selected operatingmode to the ultrasound device.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects and embodiments of the disclosed technology will bedescribed with reference to the following figures. It should beappreciated that the figures are not necessarily drawn to scale. Itemsappearing in multiple figures are indicated by the same reference numberin all the figures in which they appear.

FIG. 1A is a diagram illustrating how a universal ultrasound device maybe used to image a subject, in accordance with some embodiments of thetechnology described herein.

FIG. 1B is a block diagram of an illustrative example of a universalultrasound device, in accordance with some embodiments of the technologydescribed herein.

FIG. 2 is a block diagram illustrating how, in some embodiments, thetransmit (TX) circuitry and the receive (RX) circuitry for a giventransducer element of a universal ultrasound device may be used eitherto energize the element to emit an ultrasonic pulse, or to receive andprocess a signal from the element representing an ultrasonic pulsesensed by the transducer element, in accordance with some embodiments ofthe technology described herein.

FIG. 3 shows an illustrative arrangement of ultrasonic transducersintegrated with the substrate of a universal ultrasound device, inaccordance with some embodiments of the technology described herein.

FIG. 4 is a cross-sectional view of a device including a CMOS waferintegrated with a substrate having sealed cavities, in accordance withsome embodiments of the technology described herein.

FIGS. 5A-5H illustrate a pill comprising an ultrasound probe, inaccordance with some embodiments of the technology described herein.

FIGS. 6A-6B illustrate a handheld device comprising an ultrasound probeand a display, in accordance with some embodiments of the technologydescribed herein.

FIGS. 7A-7D illustrate a patch comprising an ultrasound probe, inaccordance with some embodiments of the technology described herein.

FIG. 8 is a diagram illustrating a handheld probe comprising anultrasound probe, in accordance with some embodiments of the technologydescribed herein.

FIG. 9 is another diagram illustrating how a universal ultrasound devicemay be used to image a subject, in accordance with some embodiments ofthe technology described herein.

FIG. 10 is a flowchart of an illustrative process for operating auniversal ultrasound device, in accordance with some embodiments of thetechnology described herein.

FIG. 11 illustrates an example of a graphical user interface throughwhich a user may select an operating mode in which to operate auniversal ultrasound device, in accordance with some embodiments of thetechnology described herein.

FIGS. 12A-B illustrate additional examples of a graphical user interfacethrough which a user may select an operating mode in which to operate auniversal ultrasound device, in accordance with some embodiments of thetechnology described herein.

FIG. 13 is a block diagram of another illustrative example of auniversal ultrasound device, in accordance with some embodiments of thetechnology described herein.

FIG. 14 illustrates another example of a graphical user interfacethrough which a user may interact with a universal ultrasound device, inaccordance with some embodiments of the technology described herein.

FIGS. 15-17 illustrate non-limiting examples of ultrasound beam shapeswhich may be generated with an ultrasound device of the types describedherein, according to non-limiting embodiments.

DETAILED DESCRIPTION

The present disclosure describes aspects of a “universal” ultrasounddevice configured to image a subject at multiple different frequencyranges. The universal ultrasound device includes multiple ultrasonictransducers at least some of which can operate at different frequencyranges, thereby enabling the use of a single ultrasound device togenerate medically-relevant images of a subject at different depths. Asa result, a single device (the universal ultrasound device describedherein) may be used by medical professionals or other users to performdifferent imaging tasks that presently require use of multipleconventional ultrasound probes.

Some embodiments are directed to an ultrasound device comprising anultrasound probe. The ultrasound probe comprises a semiconductor die; aplurality of ultrasonic transducers integrated on the semiconductor die,the plurality of ultrasonic transducers configured to operate in a firstmode associated with a first frequency range and a second modeassociated with a second frequency range, wherein the first frequencyrange is at least partially non-overlapping with the second frequencyrange; and control circuitry. The control circuitry is configured tocontrol the plurality of ultrasonic transducers to generate and/ordetect ultrasound signals having frequencies in the first frequencyrange, in response to receiving an indication to operate the ultrasoundprobe in the first mode, and control the plurality of ultrasonictransducers to generate and/or detect ultrasound signals havingfrequencies in the second frequency range, in response to receiving anindication to operate the ultrasound probe in the second mode.

The inventors have recognized that conventional ultrasound probes arelimited because each of them operates at just a single one of severalmedically-relevant frequency ranges. For example, some conventionalultrasound probes operate only at frequencies in the range of 1-3 MHz(e.g., for applications such as obstetric, abdomen and gynecologicalimaging), whereas other conventional probes operate only at frequenciesin the range of 3-7 MHz (e.g., for applications such as breast,vascular, thyroid, and pelvic imaging). Still other conventionalultrasound probes operate only at frequencies in the range of 7-15 MHz(e.g., for applications such as musculosketal and superficial vein andmass imaging). Since higher frequency ultrasound signals attenuatefaster in tissue than lower frequency ultrasound signals, conventionalprobes operating only at higher frequencies are used for generatingimages of a patient at shallow depths (e.g., 5 cm or less) forapplications such as central line placement or the aforementionedimaging of superficial masses located just beneath the skin. On theother hand, conventional probes operating only at lower frequencies areused to generate images of a patient at greater depths (e.g., 10-25 cm)for applications such as cardiac and kidney imaging. As a result, amedical professional needs to use multiple different probes, which isinconvenient and expensive, as it requires procuring multiple differentprobes configured to operate at different frequency ranges.

By contrast, the universal ultrasound device, developed by the inventorsand described herein, is configured to operate at multiple differentmedically-relevant frequency ranges and image patients at a sufficientlyhigh resolution for forming medically-relevant images at a wide range ofdepths. As such, multiple conventional ultrasound probes can all bereplaced by the single universal ultrasound device described herein, andmedical professionals or other users may use a single universalultrasound probe to perform multiple imaging tasks instead of using amultitude of conventional ultrasound probes each having limitedapplicability.

Accordingly, some embodiments provide for wideband ultrasound probehaving multiple ultrasonic transducers configured to operate in each ofa multiple of modes including a first mode associated with a firstfrequency range and a second mode associated with a second frequencyrange, which is at least partially non-overlapping with the firstfrequency range. The multi-frequency ultrasound probe further comprisescontrol circuitry that is configured to control the plurality ofultrasonic transducers to generate and/or detect ultrasound signalshaving frequencies in the first frequency range, in response toreceiving an indication to operate the ultrasound probe in the firstmode, and control the plurality of ultrasonic transducers to generateand/or detect ultrasound signals having frequencies in the secondfrequency range, in response to receiving an indication to operate theultrasound probe in the second mode. The ultrasonic transducers may beintegrated on a single substrate such as a single complementary metaloxide semiconductor (CMOS) chip, or may be on multiple chips within anultrasound probe (e.g., as shown in FIGS. 5G and 5H).

In some embodiments, the first frequency range may include frequenciesin the range of 1-5 MHz. For example, the first frequency range may becontained entirely within a range of 1-5 MHz (e.g., within a range of2-5 MHz, 1-4 MHz, 1-3 MHz, 2-5 MHz, and/or 3-5 MHz). Accordingly, whenthe ultrasonic transducers of the universal ultrasound probe areoperated to generate and/or detect ultrasound signals having frequenciesin the first frequency range, ultrasound signals detected by theultrasonic transducers may be used to form an image of a subject up totarget depths within the subject, the target depths being in a range of10-25 cm (e.g., within a range of 10-20 cm, 15-25 cm, 10-15 cm, 15-20cm, and/or 20-25 cm).

In some embodiments, the second frequency range may be containedentirely within a range of 5-12 MHz (e.g., within a range of 5-10 MHz,7-12 MHz, 5-7 MHz, 5-9 MHz, 6-8 MHz, 7-10 MHz, and/or 6-9 MHz).Accordingly, when the ultrasonic transducers of the universal ultrasoundprobe are operated to generate and/or detect ultrasound signals havingfrequencies in the second frequency range, ultrasound signals detectedby the ultrasonic transducers may be used to form an image of a subjectup to target depths within the subject, the target depths being in arange of 1-10 cm (e.g., within a range of 1-5 cm, 5-10 cm, 3-8 cm, 3-6cm, and/or 3-5 cm).

In some embodiments, the multiple modes of the universal ultrasoundprobe in combination span at least 10 MHz or between 8-15 MHz. For thisreason, a universal ultrasound probe may be sometimes called a“wideband” probe, a multi-modal probe (having multiple frequency rangemodes), and/or a multi-frequency probe.

It should be appreciated that a universal ultrasound probe is notlimited to operating in only two modes and may operate in any suitablenumber of modes (e.g., 3, 4, 5, etc.) with each of the modes beingassociated with a respective frequency range. For example, in someembodiments, the universal ultrasound probe may operate in first,second, and third modes associated with a first, second, and thirdfrequency ranges, respectively. The first, second, and third frequencyranges may be any suitable set of three ranges that, pairwise, do notentirely overlap one another. For example, the first frequency range maybe contained entirely within a range of 1-3 MHz, the second frequencyrange may be contained entirely within a range of 3-7 MHz, and the thirdfrequency range may be contained entirely within a range of 7-12 MHz. Asanother example, the first frequency range may be contained entirelywithin a range of 1-5 MHz, the second frequency range may be containedentirely within a range of 3-7 MHz, and the third frequency range may becontained entirely within a range of 5-10 MHz. In addition, each modemay also have different elevational focal regions, a feature notpossible with a single 1D array using an elevational focusing acousticlens. Each mode may also have different pitch of elements based on thefrequency of operation. The different pitch may be implemented, forexample, by subset selection and combinations of transducer cells.

As may be appreciated from the foregoing examples of frequency ranges,an operating mode of the ultrasound probe may be associated with afrequency bandwidth of at least 1 MHz, in some embodiments. In otherembodiments, an operating mode of the ultrasound probe may be associatedwith a bandwidth of at least 2 MHz, at least 3 MHz, or at least 4 MHz orhigher, as aspects of the technology described herein are not limited inthis respect. At least some of the transducers of the ultrasound probe,and in some embodiments each transducer, may not only operate atdifferent frequency ranges, but also may operate in a particularfrequency range (e.g., at a center frequency of the frequency range)with a wide bandwidth. In other embodiments (e.g., for Doppler imaging),an operating mode of the ultrasound prove may span bandwidths narrowerthan 1 MHz.

As described, ultrasound devices in accordance with one or more of thevarious aspects described herein may be used for Doppler imaging—thatis, in a Doppler mode. The ultrasound device may measure velocities in arange from about 1 cm/s to 1 m/s, or any other suitable range.

When operating in a particular mode, ultrasonic transducers of a probemay generate ultrasound signals having the largest amount of power at apeak power frequency for the mode (e.g., which may be a center frequencyof the frequency range associated with the mode). For example, whenoperating in a mode associated with a frequency range of 1-5 MHz, theultrasonic transducers may be configured to generate ultrasound signalshaving the largest amount of power at 3 MHz. Therefore, the peak powerfrequency for this mode is 3 MHz in this example. As another example,when operating in a mode associated with a frequency range of 5-9 MHz,the ultrasonic transducers may be configured to generate ultrasoundsignals having the largest amount of power at 7 MHz, which is the peakpower frequency in this example.

As may be appreciated from the foregoing examples of frequency ranges, auniversal ultrasound probe may be configured to operate in multiplemodes including a first mode associated with a first frequency rangehaving a first peak power frequency and a second mode associated with assecond frequency range having a second peak power frequency. In someinstances, the difference between the first and second peak powerfrequencies is at least a threshold amount (e.g., at least 1 MHz, atleast 2 MHz, at least 3 MHz, at least 4 MHz, at least 5 MHz, etc.).

It should be appreciated that, when operating in a frequency range, anultrasonic transducer may, in some embodiments, generate signals atfrequencies outside of the operating frequency range. However, suchsignals would be generated at less than a fraction (e.g., ½, ⅓, ⅕, etc.)of the largest power at which a signal at a center frequency of therange is generated, for example 3 dB or 6 dB down from the maximumpower.

The universal ultrasound probe described herein may be used for a broadrange of medical imaging tasks including, but not limited to, imaging apatient's liver, kidney, heart, bladder, thyroid, carotid artery, lowervenous extremity, and performing central line placement. Multipleconventional ultrasound probes would have to be used to perform allthese imaging tasks. By contrast, a single universal ultrasound probemay be used to perform all these tasks by operating, for each task, at afrequency range appropriate for the task, as shown in Table I togetherwith corresponding depths at which the subject is being imaged.

TABLE 1 Illustrative depths and frequencies at which a universalultrasound probe implemented in accordance with embodiments describedherein can image a subject. Organ Frequencies Depth (up to) Liver/RightKidney  2-5 MHz 15-20 cm   Cardiac (adult)  1-5 MHz 20 cm  Bladder 2-5MHz; 3-6 MHz 10-15 cm; 5-10 cm Lower extremity venous  4-7 MHz 4-6 cm Thyroid 7-12 MHz 4 cm Carotid 5-10 MHz 4 cm Central Line Placement 5-10MHz 4 cm

It should be appreciated that Table 1 provides a non-limiting example ofsome organs for imaging at respective depths and frequencies. However,other organs or targets may corresponded to the listed frequency ranges.For instance, the 2-5 MHz range may generally be used for abdominal,pelvic and thoracic sonography. Further examples of anatomical targetswithin this frequency range include the gallbladder, bile ducts,pancreas, gastrointestinal tract, urinary tract, spleen, adrenal glands,abdominal aorta, groin, anterior abdominal wall, peritoneum, breast, andpelvic muscles. Additionally, the 2-5 MHz range or 3-6 MHz range maygenerally be used for obstetrics, such as fetal imaging or imaging ofthe placenta. Additionally, in the 7-12 MHz range, examples ofanatomical targets other than those listed in Table 1 include theparathyroid, breast, scrotum, rotator cuff, tendons, and extracranialcerebral vessels. It should be appreciated that this list of examples isnon-limiting, and any suitable organ and frequency range combination maybe used herein.

FIG. 1A further illustrates how a universal ultrasound probe may operatein different modes, associated with different frequency ranges, to imagea subject at different depths. As shown in FIG. 1A, ultrasound probe 100is being used to image subject 101. When operating in a first mode,associated with a first frequency range (e.g., 1-3 MHz), the ultrasonictransducers in probe 100 may be configured to image the subject at orabout a point 109, also labeled P2, located at a depth D2 (e.g., 15-20cm) from the subject's skin. When operating in a second mode, associatedwith a second frequency range (e.g., 6-8 MHz), the ultrasonictransducers in probe 100 may be configured to image the subject at orabout a point 107, also labeled P1, located at a depth D1 (e.g., 1-5 cm)from the subject's skin. In some embodiments, the distance D2 is greaterthan the distance D1 by at least a threshold distance (e.g., at least 5cm, at least 7 cm, between 3 and 7 cm, or any range or number withinsuch ranges).

Ultrasound probe 100 transmit may be configured to transmit datacollected by the probe 100 to one or more external devices for furtherprocessing. For example, as shown in FIG. 1 A, ultrasound probe 100 maybe configured to transmit data collected by probe 100 via wiredconnection 103 to computing device 105 (a laptop in this non-limitingexample), which may process the data to generate and display an image111 of the subject 101 on a display.

Various factors contribute to the ability of the universal ultrasoundprobe to operate in multiple modes associated with different andmedically-relevant frequency ranges. One such factor is that theultrasonic transducers may be formed by capacitive micromachinedultrasonic transducers (CMUTs) and, in some embodiments, at least some(and in some embodiments each) of multiple ultrasonic transducers in theuniversal ultrasound probe is configured to operate in collapsed modeand in non-collapsed mode. As described herein, a “collapsed mode”refers to a mode of operation in which at least one portion of a CMUTultrasonic transducer membrane is mechanically fixed and at least oneportion of the membrane is free to vibrate based on a changing voltagedifferential between the electrode and the membrane. When operating incollapsed mode, a CMUT ultrasonic transducer is capable of generatingmore power at higher frequencies. Switching operation of multipleultrasonic transducers from non-collapsed mode into collapsed mode (andvice versa) allows the ultrasound probe to change the frequency range atwhich the highest power ultrasound signals are being emitted.

Accordingly, in some embodiments, an ultrasound probe operates in afirst mode associated with a first frequency range (e.g., 1-5 MHz, witha peak power frequency of 3 MHz) by operating its transducers innon-collapsed mode, and operates in a second mode associated with asecond frequency range (e.g., 5-9 MHz, with a peak power frequency of 7MHz) by operating its transducers in collapsed mode. In someembodiments, the ultrasound probe includes control circuitry (e.g.,circuitry 108 shown in FIG. 1B) configured to control the probe tooperate in either first mode or the second mode and, to this end, mayapply appropriate voltages to the ultrasonic transducers to cause themto operate in collapsed mode or in non-collapsed mode. For example, insome embodiments, the control circuitry is configured to causeultrasonic transducers in the probe to operate in collapsed mode byapplying a voltage to the transducers that exceeds a threshold voltage,which is sometimes called a “collapse” voltage. The collapse voltage maybe in the range of 30-110 Volts and, in some embodiments, may beapproximately 50 Volts. It should be noted that, while in someembodiments operating a probe's transducers in collapsed andnon-collapsed modes may be a factor that helps the probe to operate inmultiple frequency range modes, there may also be other factors thatallow the probe to do so (e.g., an analog receiver capable of broadbandsignal amplification of about 1-15 MHz).

Another factor that contributes to the ability of the universalultrasound probe to operate in multiple modes associated with differentand medically-relevant frequency ranges is that the ultrasonictransducers may be arranged in an array having a pitch adequate for bothhigh-frequency and low frequency scanning. For example, in someembodiments, at least some of the ultrasonic transducers may be spacedapart from its nearest neighbor at a distance less than half of awavelength corresponding to the highest frequency at which the probe isdesigned to operate to reduce (e.g., eliminate) aliasing effects. Atleast some, and in some cases each, mode(s) may also have differentpitch of elements based on the frequency of operation. The differentpitch is enabled by subset selection and combining of CMOS ultrasonictransducer (CUT) cells. Adequate pitches for a frequency are generallyspaced between about λ and λ/4, where λ is the wavelength at thespecified frequency. Exemplary pitches may include, but are not limitedto, 500 microns (μm) (very low frequencies), 200 μm (moderatefrequencies), and 125 μm (high frequencies). Also, in certainembodiments, pitches may be made wider due to element directivityhelping to suppress aliasing artifacts (e.g., on the order of λ). Thepreviously listed pitches are non-limiting, as other pitches arepossible. In some embodiments, the pitch may be within a range of about150 to 250 microns (including any value within that range) pertransducer for sector scanning. For example, a 208 micron pitch maycorrespond 3.7 MHz operation.

Another factor that contributes to the ability of the universalultrasound probe to operate in multiple modes associated with differentand medically-relevant frequency ranges is that the ultrasoundtransducers may be arranged in an array having an aperture (determinedby the width and height of the array) that allows for both shallow anddeep scans to be performed. For example, each mode may have a differentactive aperture. The total aperture accommodates the largestfield-of-view needed to cover the application space of any one probe.Examples include all combinations of 1 cm, 2 cm, 3 cm, 4 cm, 5 cm in theazimuth direction and 1 cm, 2 cm, 3 cm, 4 cm, 5 cm in the elevationdirection.

Another factor that contributes to the ability of the universalultrasound probe to operate in multiple modes associated with differentand medically-relevant frequency ranges is the selection of a CUT cellsize. Grouping CUT cells together increases both directivity andsensitivity. In addition, directivity increases with frequency as theelement remains fixed in size. Thus, grouping CUT cells together forlower frequencies can be balanced with less grouping for higherfrequencies to maintain a consistent directivity.

Another factor that contributes to the ability of the universalultrasound probe to operate in multiple modes associated with differentand medically-relevant frequency ranges is that, in addition to beingcapable of operating in multiple frequency ranges, ultrasonictransducers in the probe are capable of generating low-frequency andhigh-frequency acoustic waveforms having a broad bandwidth (e.g., atleast 100 KHz, at least 500 KHz, at least 1 MHz, at least 2 MHz, atleast 5 MHz, at least 7 MHz, at least 15 MHz, at least 20 MHz, etc.).

Another factor that contributes to the ability of the universalultrasound probe to operate in multiple modes associated with differentand medically-relevant frequency ranges is that, in some embodiments,the probe may include programmable delay mesh circuitry that allows fortransmit beamforming to focus at multiple depths, including depths inthe range of 2-35 cm. Programmable delay mesh circuitry is furtherdescribed in U.S. Pat. No. 9,229,097, assigned to the assignee of thepresent application, the contents of which are incorporated by referenceherein in their entirety.

Still another factor that contributes to the ability of the universalultrasound probe to operate in multiple modes associated with differentand medically-relevant frequency ranges is that, in some embodiments,the probe may include circuitry that allows for receive beamforming tofocus at multiple depths, including depths in the range of 2-35 cm.

In one exemplary embodiment, a universal ultrasound probe may include anarray of 576×256 ultrasonic transducers, spaced at a pitch of 52 μm, andhaving an array aperture of about 3 cm×1.33 cm. At least some of thetransducers can operate in a frequency range of 1-15 MHz with abandwidth of 0.1-12 MHz. In another exemplary embodiment, a universalultrasound probe may include an array of 64×140 transducers spaced at208 μm, and having an array aperture of about 3 cm×1.33 cm, operating ina frequency range of 1.5-5 MHz, and from 5-12 MHz.

In some embodiments, a universal ultrasound probe (e.g., probe 100) maybe implemented in any of numerous physical configurations, and has thecapabilities incorporated to perform imaging in modes as may be usedwhen imaging with two or more of the following: a linear probe, a sectorprobe, a phased array probe, a curvilinear probe, a convex probe, and/ora 3D imaging probe. Additionally, in some embodiments, the ultrasoundprobe may be embodied in a hand-held device. The hand-held device mayinclude a screen to display obtained images (e.g., as shown in FIGS.6A-6B). Additionally or alternatively, the hand-held device may beconfigured to transmit (via a wireless or a wired connection) data to anexternal device for further processing (e.g., to form one or moreultrasound images). As another example, in some embodiments, theultrasound probe may be embodied in a pill (e.g., as shown in FIGS.5A-5H) to be swallowed by a subject and configured to image the subjectas it is traveling through his/her digestive system. As another example,in some embodiments, the ultrasound probe may be embodied in a patchconfigured to be affixed to the subject (e.g., as shown in FIGS. 7A-D).

The aspects and embodiments described above, as well as additionalaspects and embodiments, are described further below. These aspectsand/or embodiments may be used individually, all together, or in anycombination of two or more, as the technology described herein is notlimited in this respect.

FIG. 1B shows an illustrative example of a monolithic ultrasound device100 embodying various aspects of the technology described herein. Asshown, the device 100 may include one or more transducer arrangements(e.g., arrays) 102, transmit (TX) circuitry 104, receive (RX) circuitry106, a timing & control circuit 108, a signal conditioning/processingcircuit 110, a power management circuit 118, and/or a high-intensityfocused ultrasound (HIFU) controller 120. In the embodiment shown, allof the illustrated elements are formed on a single semiconductor die112. It should be appreciated, however, that in alternative embodimentsone or more of the illustrated elements may be instead located off-chip.In addition, although the illustrated example shows both TX circuitry104 and RX circuitry 106, in alternative embodiments only TX circuitryor only RX circuitry may be employed. For example, such embodiments maybe employed in a circumstance where one or more transmission-onlydevices 100 are used to transmit acoustic signals and one or morereception-only devices 100 are used to receive acoustic signals thathave been transmitted through or reflected off of a subject beingultrasonically imaged.

It should be appreciated that communication between one or more of theillustrated components may be performed in any of numerous ways. In someembodiments, for example, one or more high-speed busses (not shown),such as that employed by a unified Northbridge, or one or morehigh-speed serial links (e.g. 1 Gbps, 2.5 Gbps, 5 Gbps, 10 Gbps, 20Gbps) with any suitable combined bandwidth (e.g. 10 Gbps, 20 Gbps, 40Gbps, 60 Gbps, 80 Gbps, 100 Gbps, 120 Gbps, 150 Gbps, 240 Gbps) may beused to allow high-speed intra-chip communication or communication withone or more off-chip components. In some embodiments, the communicationwith off-chip components may be in the analog domain, using analogsignals.

The one or more transducer arrays 102 may take on any of numerous forms,and aspects of the present technology do not necessarily require the useof any particular type or arrangement of transducer cells or transducerelements. Indeed, although the term “array” is used in this description,it should be appreciated that in some embodiments the transducerelements may not be organized in an array and may instead be arranged insome non-array fashion. In various embodiments, each of the transducerelements in the array 102 may, for example, include one or morecapacitive micromachined ultrasonic transducers (CMUTs), one or moreCMOS ultrasonic transducers (CUTs), one or more piezoelectricmicromachined ultrasonic transducers (PMUTs), one or more broadbandcrystal transducers, and/or one or more other suitable ultrasonictransducer cells. In some embodiments, the transducer elements of thetransducer array 102 may be formed on the same chip as the electronicsof the TX circuitry 104 and/or RX circuitry 106 or, alternativelyintegrated onto the chip having the TX circuitry 104 and/or RX circuitry106. In still other embodiments, the transducer elements of thetransducer array 102, the TX circuitry 104 and/or RX circuitry 106 maybe tiled on multiple chips.

The transducer arrays 102, TX circuitry 104, and RX circuitry 106 maybe, in some embodiments, integrated in a single ultrasound probe. Insome embodiments, the single ultrasound probe may be a hand-held probeincluding, but not limited to, the hand-held probes described below withreference to FIGS. 6A-B and 8. In other embodiments, the singleultrasound probe may be embodied in a patch that may be coupled to apatient. FIGS. 7A-D provide a non-limiting illustration of such a patch.The patch may be configured to transmit, wirelessly, data collected bythe patch to one or more external devices for further processing. Inother embodiments, the single ultrasound probe may be embodied in a pillthat may be swallowed by a patient. The pill may be configured totransmit, wirelessly, data collected by the ultrasound probe within thepill to one or more external devices for further processing. FIGS. 5A-5Hillustrate non-limiting examples of such a pill.

A CUT may include, for example, a cavity formed in a CMOS wafer, with amembrane overlying the cavity, and in some embodiments sealing thecavity. Electrodes may be provided to create a transducer cell from thecovered cavity structure. The CMOS wafer may include integratedcircuitry to which the transducer cell may be connected. The transducercell and CMOS wafer may be monolithically integrated, thus forming anintegrated ultrasonic transducer cell and integrated circuit on a singlesubstrate (the CMOS wafer). Such embodiments are further described withreference to FIG. 4 below, and additional information regardingmicrofabricated ultrasonic transducers may also be found in U.S. Pat.No. 9,067,779 and U.S. Patent Application Publication 2016/0009544 A1,both assigned to the assignee of the present application, and thecontents of both of which are incorporated by reference herein in theirentireties. It should be appreciated that the foregoing is just oneexample of an ultrasonic transducer. In some embodiments, the ultrasonictransducer (e.g., a CMUT) may be formed on a wafer separate from asubstrate with circuitry. The wafer with the ultrasonic transducers maybe bonded to an electrical substrate, which may be an interposer, aprinted circuit board (pcb), an application specific circuit (ASIC)substrate, a substrate with analog circuitry, a substrate havingintegrated CMOS circuitry (a CMOS substrate), or any other substratewith electrical functionality. In some embodiments, the ultrasonictransducers may not be formed on a wafer. For example, broadband crystaltransducers may be individually placed on a suitable substrate andcoupled to an electrical substrate. Further alternatives are possible.

The TX circuitry 104 (if included) may, for example, generate pulsesthat drive the individual elements of, or one or more groups of elementswithin, the transducer array(s) 102 so as to generate acoustic signalsto be used for imaging. The RX circuitry 106, on the other hand, mayreceive and process electronic signals generated by the individualelements of the transducer array(s) 102 when acoustic signals impingeupon such elements.

In some embodiments, the timing & control circuit 108 may be, forexample, responsible for generating all timing and control signals thatare used to synchronize and coordinate the operation of the otherelements in the device 100. In the example shown, the timing & controlcircuit 108 is driven by a single clock signal CLK supplied to an inputport 116. The clock signal CLK may be, for example, a high-frequencyclock used to drive one or more of the on-chip circuit components. Insome embodiments, the clock signal CLK may, for example, be a 1.5625 GHzor 2.5 GHz clock used to drive a high-speed serial output device (notshown in FIG. 1) in the signal conditioning/processing circuit 110, or a20 Mhz, 40 MHz, 100 MHz, 200 MHz, 250 MHz, 500 MHz, 750 MHz, or 1000 MHzclock used to drive other digital components on the die 112, and thetiming & control circuit 108 may divide or multiply the clock CLK, asnecessary, to drive other components on the die 112. In otherembodiments, two or more clocks of different frequencies (such as thosereferenced above) may be separately supplied to the timing & controlcircuit 108 from an off-chip source.

The power management circuit 118 may be, for example, responsible forconverting one or more input voltages VIN from an off-chip source intovoltages needed to carry out operation of the chip, and for otherwisemanaging power consumption within the device 100. In some embodiments,for example, a single voltage (e.g., 0.4V, 0.9V, 1.5V, 1.8V, 2.5V, 3.3V,5V, 12V, 80V, 100V, 120V, etc.) may be supplied to the chip and thepower management circuit 118 may step that voltage up or down, asnecessary, using a charge pump circuit or via some other DC-to-DCvoltage conversion mechanism. In other embodiments, multiple differentvoltages may be supplied separately to the power management circuit 118for processing and/or distribution to the other on-chip components.

As shown in FIG. 1B, in some embodiments, a HIFU controller 120 may beintegrated on the die 112 so as to enable the generation of HIFU signalsvia one or more elements of the transducer array(s) 102. In otherembodiments, a HIFU controller for driving the transducer array(s) 102may be located off-chip, or even within a device separate from thedevice 100. That is, aspects of the present disclosure relate toprovision of ultrasound-on-a-chip HIFU systems, with and withoutultrasound imaging capability. It should be appreciated, however, thatsome embodiments may not have any HIFU capabilities and thus may notinclude a HIFU controller 120.

Moreover, it should be appreciated that the HIFU controller 120 may notrepresent distinct circuitry in those embodiments providing HIFUfunctionality. For example, in some embodiments, the remaining circuitryof FIG. 1B (other than the HIFU controller 120) may be suitable toprovide ultrasound imaging functionality and/or HIFU, i.e., in someembodiments the same shared circuitry may be operated as an imagingsystem and/or for HIFU. Whether or not imaging or HIFU functionality isexhibited may depend on the power provided to the system. HIFU typicallyoperates at higher powers than ultrasound imaging. Thus, providing thesystem a first power level (or voltage level) appropriate for imagingapplications may cause the system to operate as an imaging system,whereas providing a higher power level (or voltage level) may cause thesystem to operate for HIFU. Such power management may be provided byoff-chip control circuitry in some embodiments.

In addition to using different power levels, imaging and HIFUapplications may utilize different waveforms. Thus, waveform generationcircuitry may be used to provide suitable waveforms for operating thesystem as either an imaging system or a HIFU system.

In some embodiments, the system may operate as both an imaging systemand a HIFU system (e.g., capable of providing image-guided HIFU). Insome such embodiments, the same on-chip circuitry may be utilized toprovide both functions, with suitable timing sequences used to controlthe operation between the two modalities.

In the example shown, one or more output ports 114 may output ahigh-speed serial data stream generated by one or more components of thesignal conditioning/processing circuit 110. Such data streams may be,for example, generated by one or more USB 2.0, 3.0 and 3.1 modules,and/or one or more 1 Gb/s, 10 Gb/s, 40 Gb/s, or 100 Gb/s Ethernetmodules, integrated on the die 112. In some embodiments, the signalstream produced on output port 114 can be fed to a computer, tablet, orsmartphone for the generation and/or display of 2-dimensional,3-dimensional, and/or tomographic images. It should be appreciated thatthe listed images are only examples of possible image types. Otherexamples may include 1-dimensional images, 0-dimensional spectralDoppler images, and time-varying images, including images combing 3Dwith time (time varying 3D images). In embodiments in which imageformation capabilities are incorporated in the signalconditioning/processing circuit 110, even relatively low-power devices,such as smartphones or tablets which have only a limited amount ofprocessing power and memory available for application execution, candisplay images using only a serial data stream from the output port 114.As noted above, the use of on-chip analog-to-digital conversion and ahigh-speed serial data link to offload a digital data stream is one ofthe features that helps facilitate an “ultrasound on a chip” solutionaccording to some embodiments of the technology described herein.

Devices 100 such as that shown in FIGS. 1A and 1B may be used in any ofa number of imaging and/or treatment (e.g., HIFU) applications, and theparticular examples discussed herein should not be viewed as limiting.In one illustrative implementation, for example, an imaging deviceincluding an N×M planar or substantially planar array of CMUT elementsmay itself be used to acquire an ultrasonic image of a subject, e.g., aperson's abdomen, by energizing some or all of the elements in thearray(s) 102 (either together or individually) during one or moretransmit phases, and receiving and processing signals generated by someor all of the elements in the array(s) 102 during one or more receivephases, such that during each receive phase the CMUT elements senseacoustic signals reflected by the subject. In other implementations,some of the elements in the array(s) 102 may be used only to transmitacoustic signals and other elements in the same array(s) 102 may besimultaneously used only to receive acoustic signals. Moreover, in someimplementations, a single imaging device may include a P×Q array ofindividual devices, or a P×Q array of individual N×M planar arrays ofCMUT elements, which components can be operated in parallel,sequentially, or according to some other timing scheme so as to allowdata to be accumulated from a larger number of CMUT elements than can beembodied in a single device 100 or on a single die 112.

Transmit and Receive Circuitry

FIG. 2 is a block diagram illustrating how, in some embodiments, the TXcircuitry 104 and the RX circuitry 106 for a given transducer element204 may be used either to energize the transducer element 204 to emit anultrasonic pulse, or to receive and process a signal from the transducerelement 204 representing an ultrasonic pulse sensed by it. In someimplementations, the TX circuitry 104 may be used during a“transmission” phase, and the RX circuitry may be used during a“reception” phase that is non-overlapping with the transmission phase.As noted above, in some embodiments, a device 100 may alternativelyemploy only TX circuitry 104 or only RX circuitry 106, and aspects ofthe present technology do not necessarily require the presence of bothsuch types of circuitry. In various embodiments, TX circuitry 104 and/orRX circuitry 106 may include a TX circuit and/or an RX circuitassociated with a single transducer cell (e.g., a CUT or CMUT), a groupof two or more transducer cells within a single transducer element 204,a single transducer element 204 comprising a group of transducer cells,a group of two or more transducer elements 204 within an array 102, oran entire array 102 of transducer elements 204.

In the example shown in FIG. 2, the TX circuitry 104/RX circuitry 106includes a separate TX circuit and a separate RX circuit for eachtransducer element 204 in the array(s) 102, but there is only oneinstance of each of the timing & control circuit 108 and the signalconditioning/processing circuit 110. Accordingly, in such animplementation, the timing & control circuit 108 may be responsible forsynchronizing and coordinating the operation of all of the TX circuitry104/RX circuitry 106 combinations on the die 112, and the signalconditioning/processing circuit 110 may be responsible for handlinginputs from all of the RX circuitry 106 on the die 112. In otherembodiments, timing and control circuit 108 may be replicated for eachtransducer element 204 or for a group of transducer elements 204.

As shown in FIG. 2, in addition to generating and/or distributing clocksignals to drive the various digital components in the device 100, thetiming & control circuit 108 may output either an “TX enable” signal toenable the operation of each TX circuit of the TX circuitry 104, or an“RX enable” signal to enable operation of each RX circuit of the RXcircuitry 106. In the example shown, a switch 202 in the RX circuitry106 may always be opened during the TX circuitry 104 is enabled, so asto prevent an output of the TX circuitry 104 from driving the RXcircuitry 106. The switch 202 may be closed when operation of the RXcircuitry 106 is enabled, so as to allow the RX circuitry 106 to receiveand process a signal generated by the transducer element 204.

As shown, the TX circuitry 104 for a respective transducer element 204may include both a waveform generator 206 and a pulser 208. The waveformgenerator 206 may, for example, be responsible for generating a waveformthat is to be applied to the pulser 208, so as to cause the pulser 208to output a driving signal to the transducer element 204 correspondingto the generated waveform.

In the example shown in FIG. 2, the RX circuitry 106 for a respectivetransducer element 204 includes an analog processing block 210, ananalog-to-digital converter (ADC) 212, and a digital processing block214. The ADC 212 may, for example, comprise a 5-bit, 6-bit, 7-bit,8-bit, 10-bit, 12-bit or 14-bit, and 5 MHz, 20 MHz, 25 MHz, 40 MHz, 50MHz, or 80 MHz ADC. The ADC timing may be adjusted to run at samplerates corresponding to the mode based needs of the applicationfrequencies. For example, a 1.5 MHz acoustic signal may be detected witha setting of 20 MHz. The choice of a higher vs. lower ADC rate providesa balance between sensitivity and power vs. lower data rates and reducedpower, respectively. Therefore, lower ADC rates facilitate faster pulserepetition frequencies, increasing the acquisition rate in a specificmode and, in at least some embodiments, reducing the memory andprocessing requirements while still allowing for high resolution inshallow modes.

After undergoing processing in the digital processing block 214, theoutputs of all of the RX circuits on the die 112 (the number of which,in this example, is equal to the number of transducer elements 204 onthe chip) are fed to a multiplexer (MUX) 216 in the signalconditioning/processing circuit 110. In other embodiments, the number oftransducer elements is larger than the number of RX circuits, andseveral transducer elements provide signals to a single RX circuit. TheMUX 216 multiplexes the digital data from the RX circuits, and theoutput of the MUX 216 is fed to a multiplexed digital processing block218 in the signal conditioning/processing circuit 110, for finalprocessing before the data is output from the die 112, e.g., via one ormore high-speed serial output ports 114. The MUX 216 is optional, and insome embodiments parallel signal processing is performed, for examplewhere the output of each RX circuit is fed into a suitable dedicateddigital processing block. A high-speed serial data port may be providedat any interface between or within blocks, any interface between chipsand/or any interface to a host. Various components in the analogprocessing block 210 and/or the digital processing block 214 may reducethe amount of data that needs to be output from the die 112 via ahigh-speed serial data link or otherwise. In some embodiments, forexample, one or more components in the analog processing block 210and/or the digital processing block 214 may thus serve to allow the RXcircuitry 106 to receive transmitted and/or scattered ultrasoundpressure waves with an improved signal-to-noise ratio (SNR) and in amanner compatible with a diversity of waveforms. The inclusion of suchelements may thus further facilitate and/or enhance the disclosed“ultrasound-on-a-chip” solution in some embodiments.

Although particular components that may optionally be included in theanalog processing block 210 are described below, it should beappreciated that digital counterparts to such analog components mayadditionally or alternatively be employed in the digital processingblock 214. The converse is also true. That is, although particularcomponents that may optionally be included in the digital processingblock 214 are described below, it should be appreciated that analogcounterparts to such digital components may additionally oralternatively be employed in the analog processing block 210.

Layout of Ultrasonic Transducers

FIG. 3 shows substrate 302 (e.g., a semiconductor die) of an ultrasounddevice having multiple ultrasound circuitry modules 304 formed thereon.As shown, an ultrasound circuitry module 304 may comprise multipleultrasound elements 306. An ultrasound element 306 may comprise multipleultrasonic transducers 308, sometimes termed ultrasonic transducers.

In the illustrated embodiment, substrate 302 comprises 144 modulesarranged as an array having two rows and 72 columns. However, it shouldbe appreciated that a substrate of a single substrate ultrasound devicemay comprise any suitable number of ultrasound circuitry modules (e.g.,at least two modules, at least ten modules, at least 100 modules, atleast 400 modules, at least 1000 modules, at least 5000 modules, atleast 10,000 modules, at least 25,000 modules, at least 50,000 modules,at least 100,000 modules, at least 250,000 modules, at least 500,000modules, between two and a million modules, or any number or range ofnumbers within such ranges) that may be arranged as an two-dimensionalarray of modules having any suitable number of rows and columns or inany other suitable way.

In the illustrated embodiment, each ultrasound circuitry module 304comprises 64 ultrasound elements arranged as an array having 32 rows andtwo columns. However, it should be appreciated that an ultrasoundcircuitry module may comprise any suitable number of ultrasound elements(e.g., one ultrasound element, at least two ultrasound elements, atleast four ultrasound elements, at least eight ultrasound elements, atleast 16 ultrasound elements, at least 32 ultrasound elements, at least64 ultrasound elements, at least 128 ultrasound elements, at least 256ultrasound elements, at least 512 ultrasound elements, between two and1024 elements, at least 2500 elements, at least 5,000 elements, at least10,000 elements, at least 20,000 elements, between 5000 and 15000elements, between 8000 and 12000 elements, between 1000 and 20,000elements, or any number or range of numbers within such ranges) that maybe arranged as a two-dimensional array of ultrasound elements having anysuitable number of rows and columns or in any other suitable way.

In the illustrated embodiment, each ultrasound element 306 comprises 16ultrasonic transducers arranged as a two-dimensional array having fourrows and four columns. However, it should be appreciated that anultrasound element may comprise any suitable number and/or groupings ofultrasonic transducer cells (e.g., one, at least two, four, at leastfour, 9, at least 9, at least 16, 25, at least 25, at least 36, at least49, at least 64, at least 81, at least 100, between one and 200, or anynumber or range of numbers within such ranges) that may be arranged as atwo dimensional array having any suitable number of rows and columns(square or rectangular) or in any other suitable way. In addition, thetransducer cells may include shapes such as circular, oval, square,hexagonal, or other regular or irregular polygons, for example.

It should be appreciated that any of the components described above(e.g., ultrasound transmission units, ultrasound elements, ultrasonictransducers) may be arranged as a one-dimensional array, as atwo-dimensional array, or in any other suitable manner.

In some embodiments, an ultrasound circuitry module may comprisecircuitry in addition to one or more ultrasound elements. For example,an ultrasound circuitry module may comprise one or more waveformgenerators and/or any other suitable circuitry.

In some embodiments, module interconnection circuitry may be integratedwith the substrate 302 and configured to connect ultrasound circuitrymodules to one another to allow data to flow among the ultrasoundcircuitry modules. For example, the device module interconnectioncircuitry may provide for connectivity among adjacent ultrasoundcircuitry modules. In this way, an ultrasound circuitry module may beconfigured to provide data to and/or received data from one or moreother ultrasound circuitry modules on the device.

Ultrasonic Transducers

The ultrasonic transducers of a universal ultrasound probe may be formedin any of numerous ways and, in some embodiments, may be formed asdescribed with reference to FIG. 4.

FIG. 4 is a cross-sectional view of an ultrasound device including aCMOS wafer integrated with an engineered substrate having sealedcavities, according to a non-limiting embodiment of the presentapplication. The device 400 may be formed in any suitable way and, forexample, by implementing the methods described in the aforementionedU.S. Pat. No. 9,067,779.

The device 400 includes an engineered substrate 402 integrated with aCMOS wafer 404. The engineered substrate 402 includes a plurality ofcavities 406 formed between a first silicon device layer 408 and asecond silicon device layer 410. A silicon oxide (SiO₂) layer 412 (e.g.,a thermal silicon oxide-a silicon oxide formed by thermal oxidation ofsilicon) may be formed between the first and second silicon devicelayers 408 and 410, with the cavities 406 being formed therein. In thisnon-limiting example, the first silicon device layer 408 may beconfigured as a bottom electrode and the second silicon device layer 410may be configured as a membrane. Thus, the combination of the firstsilicon device layer 408, second silicon device layer 410, and cavities406 may form an ultrasonic transducer (e.g., a CMUT), of which six areillustrated in this non-limiting cross-sectional view. To facilitateoperation as a bottom electrode or membrane, one or both of the firstsilicon device layer 408 and second silicon device layer 410 may bedoped to act as conductors, and in some cases are highly doped (e.g.,having a doping concentration greater than 1015 dopants/cm 3 orgreater). In some embodiments, the silicon oxide layer 412 containingthe formed cavities may be formed as a plurality of insulating layers.For example, the silicon oxide layer 412 may comprise a first layer,with the formed cavities, and a second continuous layer with no cavitiesas an insulating layer for collapsed mode operation, for example.

The engineered substrate 402 may further include an oxide layer 414 ontop of the second silicon device layer 410, which may represent the BOXlayer of a silicon-on-insulator (SOI) wafer used to form the engineeredsubstrate 402. The oxide layer 414 may function as a passivation layerin some embodiments and, as shown, may be patterned to be absent overthe cavities 406. Contacts 424, and passivation layer 430 may beincluded on the engineered substrate 402. The passivation layer 430 maybe patterned to allow access to one or more contacts 424, and may beformed of any suitable passivating material. In some embodiments, thepassivation layer 430 is formed of silicon nitride Si3N₄ and in someembodiments is formed by a stack of SiO2 and Si3N₄, althoughalternatives are possible.

The engineered substrate 402 and CMOS wafer 404 may be bonded togetherat bond points 416 a and 416 b. The bond points may represent eutecticbond points, for example formed by a eutectic bond of a layer onengineered substrate 402 with a layer on CMOS wafer 404, or may be anyother suitable bond type described herein (e.g., a silicide bond orthermocompression bond). In some embodiments, the bond points 416 a and416 b may be conductive, for example being formed of metal. The bondpoints 416 a may function solely as bond points in some embodiments, andin some embodiments may form a seal ring, for example hermeticallysealing the ultrasonic transducers of the device 400, and improvingdevice reliability. In some embodiments, the bond points 416 a maydefine a seal ring that also provides electrical connection between theengineered substrate and CMOS wafer. Similarly, the bond points 416 bmay serve a dual purpose in some embodiments, for example serving asbond points and also providing electrical connection between theultrasonic transducers of the engineered substrate 402 and the IC of theCMOS wafer 404. In those embodiments in which the engineered substrateis not bonded with a CMOS wafer the bond points 416 b may provideelectrical connection to any electrical structures on a substrate towhich the engineered substrate is bonded.

The CMOS wafer 404 includes a base layer (e.g., a bulk silicon wafer)418, an insulating layer 420 (e.g., Si02), and a metallization 422. Themetallization 422 may be formed of aluminum, copper, or any othersuitable metallization material, and may represent at least part of anintegrated circuit formed in the CMOS wafer. For example, metallization422 may serve as a routing layer, may be patterned to form one or moreelectrodes, or may be used for other functions. In practice, the CMOSwafer 404 may include multiple metallization layers and/orpost-processed redistribution layers, but for simplicity, only a singlemetallization is illustrated.

The bond points 416 b may provide electrical connection between themetallization 422 of CMOS wafer 404 and the first silicon device layer408 of the engineered substrate. In this manner, the integratedcircuitry of the CMOS wafer 404 may communicate with (e.g., sendelectrical signals to and/or receive electrical signals from) theultrasonic transducer electrodes and/or membranes of the engineeredsubstrate. In the illustrated embodiments, a separate bond point 416 bis illustrated as providing electrical connection to each sealed cavity(and therefore for each ultrasonic transducer), although not allembodiments are limited in this manner. For example, in someembodiments, the number of electrical contacts provided may be less thanthe number of ultrasonic transducers.

Electrical contact to the ultrasonic transducer membranes represented bysecond silicon device layer 410 is provided in this non-limiting exampleby contacts 424, which may be formed of metal or any other suitableconductive contact material. In some embodiments, an electricalconnection may be provided between the contacts 424 and the bond pad 426on the CMOS wafer. For example, a wire bond 425 may be provided or aconductive material (e.g., metal) may be deposited over the uppersurface of the device and patterned to form a conductive path from thecontacts 424 to the bond pad 426. However, alternative manners ofconnecting the contacts 424 to the IC on the CMOS wafer 404 may be used.In some embodiments an embedded via (not shown in FIG. 4) may beprovided from the first silicon device layer 408 to a bottom side of thesecond silicon device layer 410, thus obviating any need for thecontacts 424 on the topside of the second silicon device layer 410. Insuch embodiments, suitable electrical isolation may be provided relativeto any such via to avoid electrically shorting the first and secondsilicon device layers.

The device 400 also includes isolation structures (e.g., isolationtrenches) 428 configured to electrically isolate groups of ultrasonictransducers (referred to herein as “ultrasonic transducer elements”) or,as shown in FIG. 4, individual ultrasonic transducers. The isolationstructures 428 may include trenches through the first silicon devicelayer 408 that are filled with an insulating material in someembodiments. Alternatively, the isolation structures 428 may be formedby suitable doping. Isolation structures 428 are optional.

Various features of the device 400 are now noted. For instance, itshould be appreciated that the engineered substrate 402 and CMOS wafer404 wafer may be monolithically integrated, thus providing formonolithic integration of ultrasonic transducers with CMOS ICs. In theillustrated embodiment, the ultrasonic transducers are positionedvertically (or stacked) relative to the CMOS IC, which may facilitateformation of a compact ultrasound device by reducing the chip arearequired to integrate the ultrasonic transducers and CMOS IC.

Additionally, the engineered substrate 402 includes only two siliconlayers 408 and 410, with the cavities 406 being formed between them. Thefirst silicon device layer 408 and second silicon device layer 410 maybe thin, for example each being less than 50 microns in thickness, lessthan 30 microns in thickness, less than 20 microns in thickness, lessthan 10 microns in thickness, less than 5 microns in thickness, lessthan 3 microns in thickness, or approximately 2 microns in thickness,among other non-limiting examples. In some embodiments it is preferablefor one of the two wafers (e.g., silicon layer 408 or silicon layer 410)of the engineered substrate to be sufficiently thick to minimizevibration, prevent vibration or shift the frequency of unwantedvibration to a range outside of the operating range of the device,thereby preventing interference. Through modeling of the geometries inthe physical stack of the transducer integrated with the CMOS,thicknesses of all layers can be optimized for transducer centerfrequency and bandwidth, with minimal interfering vibration. This mayinclude, but is not limited to, changing layer thicknesses and featuresin the transducer engineered substrate and changing the thickness of theCMOS wafer 418. These layer thicknesses are also chosen to provideuniformity across the area of the array, and therefore tighter frequencyuniformity, using commercially available wafers. The array may besubstantially flat, in that the substrate may lack curvature. Still, asdescribed herein, multiple ultrasound imaging modes may be achieved,including those for which curved transducer arrays are typically used.The lack of curvature of the substrate may be quantified in someembodiments as the substrate deviating from planar by no more than 0.5cm across the array, e.g. deviation of 0.2 cm, 0.1 cm, or less.

Thus, while the engineered substrate may be thin, it may have athickness of at least, for example, 4 microns in some embodiments, atleast 5 microns in some embodiments, at least 7 microns in someembodiments, at least 10 microns in some embodiments, or other suitablethickness to prevent unwanted vibration. Such dimensions contribute toachieving a small device and may facilitate making electrical contact tothe ultrasonic transducer membrane (e.g., second silicon device layer410) without the need for thru-silicon vias (TSVs). TSVs are typicallycomplicated and costly to implement, and thus avoiding use of them mayincrease manufacturing yield and reduce device cost. Moreover, formingTSVs requires special fabrication tools not possessed by many commercialsemiconductor foundries, and thus avoiding the need for such tools canimprove the supply chain for forming the devices, making them morecommercially practical than if TSVs were used.

The engineered substrate 402 as shown in FIG. 4 may be relatively thin,for example being less than I00 microns in total thickness, less than 50microns in total thickness, less than 30 microns in total thickness,less than 20 microns in total thickness, less than 10 microns in totalthickness, or any other suitable thickness. The significance of suchthin dimensions includes the lack of structural integrity and theinability to perform various types of fabrication steps (e.g., waferbonding, metallization, lithography and etch) with layers having suchinitially thin dimensions. Thus, it is noteworthy that such thindimensions may be achieved in the device 400, via a process sequence.

Also, the silicon device layers 408 and 410 may be formed of singlecrystal silicon. The mechanical and electrical properties of singlecrystal silicon are stable and well understood, and thus the use of suchmaterials in an ultrasonic transducer (e.g., as the membrane of a CMUT)may facilitate design and control of the ultrasonic transducer behavior.

In one embodiment, there is a gap between parts of the CMOS wafer 404and the first silicon device layer 408 since the two are bonded atdiscrete bond points 4 1 6 b rather than by a bond covering the entiresurface of the CMOS wafer 404. The significance of this gap is that thefirst silicon device layer 408 may vibrate if it is sufficiently thin.Such vibration may be undesirable, for instance representing unwantedvibration in contrast to the desired vibration of the second silicondevice layer 410. Accordingly, it is beneficial in at least someembodiments for the first silicon device layer 408 to be sufficientlythick to minimize vibration, avoid vibration or shift the frequency ofany unwanted vibration outside of the operating frequency range of thedevice.

In alternative embodiments, it may be desirable for both the first andsecond silicon device layers 408 and 410 to vibrate. For instance, theymay be constructed to exhibit different resonance frequencies, thuscreating a multi-frequency device. The multiple resonance frequencies(which may be related as harmonics in some embodiments) may be used, forexample, in different operating states of an ultrasonic transducer. Forexample, the first silicon device layer 408 may be configured toresonate at half the center frequency of the second silicon device layer410.

In still another embodiment, the strength of the bond between silicondevice layer 410 and silicon oxide layer 412 allows for cavities 406formed within silicon oxide layer 412 to have a larger diameter thanwould be possible with a weaker bond between layers 410 and 412. Thediameter of a cavity is indicated as “w” in FIG. 4. The bond strength isprovided at least in part by using a fabrication process in which theengineered substrate 402 is formed by bonding (e.g., at temperature lessthan about 400° C.) of two wafers, one containing silicon device layer408 and the other containing silicon device layer 410, followed by ahigh temperature anneal (e.g., about 1000° C.). Ultrasonic transducersimplemented using wide cavities may generate ultrasonic signals havingmore power at a particular frequency than ultrasonic signals generatedat the same particular frequency by ultrasonic transducers implementedusing cavities have a smaller diameter. In turn, higher power ultrasonicsignals penetrate deeper into a subject being imaged thereby enablinghigh-resolution imaging of a subject at greater depths than possiblewith ultrasonic transducers having smaller cavities. For example,conventional ultrasound probes may use high frequency ultrasound signals(e.g., signals having frequencies in the 7-12 MHz range) to generatehigh-resolution images, but only at shallow depths due to the rapidattenuation of high-frequency ultrasound signals in the body of asubject being imaged. However, increasing the power of the ultrasonicsignals emitted by an ultrasound probe (e.g., as enabled through the useof cavities having a larger diameter as made possible by the strength ofthe bond between layers 410 and 412) allows the ultrasonic signals topenetrate the subject deeper resulting in high-resolution images of thesubject at greater depths than previously possible with conventionalultrasound probes.

Additionally, an ultrasonic transducer formed using a larger diametercavity may generate lower frequency ultrasound signals than anultrasonic transducer having a cavity with a smaller diameter. Thisextends the range of frequencies across which the ultrasonic transducermay operate. An additional technique may be to selectively etch and thinportions of the transducer top membrane 410. This introduces springsoftening in the transducer membrane, thereby lowering the centerfrequency. This may be done on all, some or none of the transducers inthe array in any combination of patterns.

Forms of Universal Ultrasound Device

A universal ultrasound device may be implemented in any of a variety ofphysical configurations including, for example, as a part of an internalimaging device, such as a pill to be swallowed by a subject or a pillmounted on an end of a scope or catheter, as part of a handheld deviceincluding a screen to display obtained images, as part of a patchconfigured to be affixed to the subject, or as part of a hand-heldprobe.

In some embodiments, a universal ultrasound probe may be embodied in apill to be swallowed by a subject. As the pill travels through thesubject, the ultrasound probe within the pill may image the subject andwirelessly transmit obtained data to one or more external devices forprocessing the data received from the pill and generating one or moreimages of the subject. For example, as shown in FIG. 5A, pill 502comprising an ultrasound probe may be configured to communicatewirelessly (e.g., via wireless link 501) with external device 500, whichmay be a desktop, a laptop, a handheld computing device, and/or anyother device external to pill 502 and configured to process datareceived from pill 502. A person may swallow pill 502 and, as pill 502travels through the person's digestive system, pill 502 may image theperson from within and transmit data obtained by the ultrasound probewithin the pill to external device 500 for further processing. In someembodiments, the pill 502 may comprise an onboard memory and the pill502 may store the data on the onboard memory such that the data may berecovered from the pill 502 once it has exited the person.

In some embodiments, a pill comprising an ultrasound probe may beimplemented by potting the ultrasound probe within an outer case, asillustrated by an isometric view of pill 504 shown in FIG. 5B. FIG. 5Cis a section view of pill 504 shown in FIG. 5B exposing views of theelectronic assembly and batteries. In some embodiments, a pillcomprising an ultrasound probe may be implemented by encasing theultrasound probe within an outer housing, as illustrated by an isometricview of pill 506 shown in FIG. 5D. FIG. 5E is an exploded view of pill506 shown in FIG. 5D showing outer housing portions 510 a and 510 b usedto encase electronic assembly 510 c.

In some embodiments, the ultrasound probe implemented as part of a pillmay comprise one or multiple ultrasonic transducer (e.g., CMUT) arrays,one or more image reconstruction chips, an FPGA, communicationscircuitry, and one or more batteries. For example, as shown in FIG. 5F,pill 508 a may include multiple ultrasonic transducer arrays shown insections 508 b and 508 c, multiple image reconstruction chips as shownin sections 508 c and 508 d, a Wi-Fi chip as shown in section 508 d, andbatteries as shown in sections 508 d and 508 e.

FIGS. 5G and 5H further illustrate the physical configuration ofelectronics module 506 c shown in FIG. 5E. As shown in FIGS. 5G and 5H,electronics module 506 c includes four CMUT arrays 512 (though more orfewer CMUT arrays may be used in other embodiments), bond wireencapsulant 514, four image reconstruction chips 516 (though more orfewer image reconstruction chips may be used in other embodiments), flexcircuit 518, Wi-Fi chip 520, FPGA 522, and batteries 524. Each of thebatteries may be of size 13 PR48. Each of the batteries may be a 300 mAh1.4V battery. Other batteries may be used, as aspects of the technologydescribed herein are not limited in this respect.

In some embodiments, the ultrasonic transducers of an ultrasound probein a pill are physically arranged such that the field of view of theprobe within the pill is equal to or as close to 360 degrees aspossible. For example, as shown in FIGS. 5G and 5H, each of the fourCMUT arrays may a field of view of approximately 60 degrees (30 degreeson each side of a vector normal to the surface of the CMUT array) or afield of view in a range of 40-80 degrees such that the pillconsequently has a field of view of approximately 240 degrees or a fieldof view in a range of 160-320 degrees. In some embodiments, the field ofview may be linear where under the array, rectilinear under the probespace, and trapezoidal out 30 degrees or for example any value between15 degrees and 60 degrees, as a non-limiting example.

In some embodiments, a universal ultrasound probe may be embodied in ahandheld device 602 illustrated in FIGS. 6A and 6B. Handheld device 602may be held against (or near) a subject 600 and used to image thesubject. Handheld device 602 may comprise an ultrasound probe (e.g., auniversal ultrasound probe) and display 604, which in some embodiments,may be a touchscreen. Display 604 may be configured to display images ofthe subject generated within handheld device 602 using ultrasound datagathered by the ultrasound probe within device 602.

In some embodiments, handheld device 602 may be used in a manneranalogous to a stethoscope. A medical professional may place handhelddevice 602 at various positions along a patient's body. The ultrasoundprobe within handheld device 602 may image the patient. The dataobtained by the ultrasound probe may be processed and used to generateimage(s) of the patient, which image(s) may be displayed to the medicalprofessional via display 604. As such, a medical professional couldcarry hand-held device (e.g., around their neck or in their pocket)rather than carrying around multiple conventional probes, which isburdensome and impractical.

In some embodiments, a universal ultrasound probe may be embodied in apatch that may be coupled to a patient. For example, FIGS. 7A and 7Billustrate a patch 710 coupled to patient 712. The patch 710 may beconfigured to transmit, wirelessly for example, data collected by thepatch 710 to one or more external devices (not shown) for furtherprocessing. For purposes of illustration, a top housing of the patch 710is depicted in a transparent manner to depict exemplary locations ofvarious internal components of the patch.

FIGS. 7C and 7D show exploded views of patch 710. As particularlyillustrated in FIG. 7C, patch 710 includes upper housing 714, lowerhousing 716, and circuit board 718. Circuit board 718 may be configuredto support various components, such as for example heat sink 720,battery 722 and communications circuitry 724. In one embodiment,communication circuitry 724 includes one or more short- or long-rangecommunication platform. Exemplary short-range communication platformsinclude, Bluetooth (BT), Bluetooth Low Energy (BLE), Near-FieldCommunication (NFC). Long-range communication platforms include, Wi-Fiand Cellular. While not shown, the communication platform may includefront-end radio, antenna and other processing circuitry configured tocommunicate radio signal to and auxiliary device (not shown). The radiosignal may include ultrasound imaging information obtained by patch 710.

In an exemplary embodiment, communication circuitry transmits periodicbeacon signals according to IEEE 802.11 and other prevailing standards.The beacon signal may include a BLE advertisement. Upon receipt of thebeacon signal or the BLE advertisement, an auxiliary device (not shown)may respond to patch 710. That is, the response to the beacon signal mayinitiate a communication handshake between patch 710 and the auxiliarydevice.

The auxiliary device may include laptop, desktop, smartphone or anyother device configured for wireless communication. The auxiliary devicemay act as a gateway to cloud or internet communication. In an exemplaryembodiment, the auxiliary device may include the patient's own smartdevice (e.g., smartphone) which communicatively couples to patch 710 andperiodically receives ultrasound information from patch 710. Theauxiliary device may then communicate the received ultrasoundinformation to external sources.

Circuit board 718 may comprise one or more processing circuitry,including one or more controllers to direct communication throughcommunication circuitry 724. For example, circuit board 718 may engagecommunication circuity periodically or on as-needed basis to communicateinformation with one or more auxiliary devices. Ultrasound informationmay include signals and information defining an ultrasound imagecaptured by patch 710. Ultrasound information may also include controlparameters communicated from the auxiliary device to patch 710. Thecontrol parameters may dictate the scope of the ultrasound image to beobtained by patch 710.

In one embodiment, the auxiliary device may store ultrasound informationreceived from patch 710. In another embodiment, the auxiliary device mayrelay ultrasound information received from patch 710 to another station.For example, the auxiliary device may use Wi-Fi to communicate theultrasound information received from patch 710 to a cloud-based server.The cloud-based server may be a hospital server or a server accessibleto the physician directing ultrasound imaging. In another exemplaryembodiment, patch 710 may send sufficient ultrasound information to theauxiliary device such that the auxiliary device may construct anultrasound image therefrom. In this manner, communication bandwidth andpower consumption may be minimized at patch 710.

In still another embodiment, the auxiliary device may engage patch 710through radio communication (i.e., through communication circuitry 724)to actively direct operation of patch 710. For example, the auxiliarydevice may direct patch 710 to produce ultrasound images of the patientat periodic intervals. The auxiliary device may direct the depth of theultrasound images taken by patch 710. In still another example, theauxiliary device may control the manner of operation of the patch so asto preserve power consumption at battery 722. Upon receipt of ultrasoundinformation from patch 710, the auxiliary device may operate to ceaseimaging, increase imaging rate or communicate an alarm to the patient orto a third party (e.g., physician or emergency personnel).

It should be noted that the communication platform described in relationwith FIG. 7 may also be implemented in other form-factors disclosedherein. For example, the communication platform (including controlcircuitry and any interface) may be implemented in the ultrasound pillas illustrated in FIGS. 5A-5H, the handheld device as illustrated inFIGS. 6A-6B or the handheld probe as illustrated in FIG. 8.

As shown in FIG. 7C, a plurality of through vias 726 (e.g., copper) maybe used for a thermal connection between heat sink 720 and one or moreimage reconstruction chips (e.g., CMOS) (not shown in FIG. 7C). Asfurther depicted in FIG. 7C, patch 710 may also include dressing 728that provides an adhesive surface for both the patch housing as well asto the skin of a patient. One non-limiting example of such a dressing728 is Tegaderm™, a transparent medical dressing available from 3MCorporation. Lower housing 716 includes a generally rectangular shapedopening 730 that aligns with another opening 732 in dressing 728.

Referring to FIG. 7D, another “bottom up” exploded view of the patch 710illustrates the location of ultrasonic transducers and integrated CMOSchip (generally indicated by 734) on circuit board 718. An acoustic lens736 mounted over the transducers/CMOS 734 is configured to protrudethrough openings 730, 732 to make contact with the skin of a patient.Although the embodiment of FIGS. 7A-7D depict an adhesive dressing 728as a means of affixing patch 710 to patient 712, it will be appreciatedthat other fastening arrangements are also contemplated. For example, astrap (not shown) may be used in lieu of (or in addition to) dressing728 in order to secure the patch 710 at a suitable imaging location.

In some embodiments, a universal ultrasound probe may be embodied inhand-held probe 800 shown in FIG. 8. Hand-held probe 800 may beconfigured to transmit data collected by the probe 800 wirelessly to oneor more external host devices (not shown in FIG. 8) for furtherprocessing. In other embodiments, hand-held probe 800 may be configuredtransmit data collected by the probe 800 to one or more external devicesusing one or more wired connections, as aspects of the technologydescribed herein are not limited in this respect.

Some embodiments of the technology described herein relate to anultrasound device that may be configured to operate in any one ofmultiple operating modes. Each of the operating modes may be associatedwith a respective configuration profile that specifies a plurality ofparameter values used for operating the ultrasound device. In someembodiments, the operating mode of the ultrasound device may be selectedby a user, for example, via a graphical user interface presented by amobile computing device communicatively coupled to the ultrasounddevice. In turn, an indication of the operating mode selected by theuser may be communicated to the ultrasound device, and the ultrasounddevice may: (1) access a configuration profile associated with theselected operating mode; and (2) use parameter values specified by theaccessed configuration profile to operate in the selected operatingmode.

Accordingly, some embodiments provide for a system comprising: (1) anultrasound device (e.g., a handheld ultrasound probe or a wearableultrasound probe) having a plurality of ultrasonic transducers andcontrol circuitry; and (2) a computing device (e.g., a mobile computingdevice such as a smart phone) that allows a user to select an operatingmode for the ultrasound device (e.g., via a graphical user interfacepresented to the user via a display coupled to and/or integrated withthe computing device) and provides an indication of the selectedoperating mode to the ultrasound device. In turn, the control circuitryin ultrasound device may: (1) receive the indication of the selectedoperating mode; (2) responsive to receiving an indication of the firstoperating mode: obtain a first configuration profile specifying a firstset of parameter values associated with the first operating mode; andcontrol, using the first configuration profile, the ultrasound device tooperate in the first operating mode; and (3) responsive to receiving anindication of the second operating mode, obtain a second configurationprofile specifying a second set of parameter values associated with thesecond operating mode; and control, using the second configurationprofile, the ultrasound device to operate in the second operating mode.

In some embodiments, different configuration profiles for differentoperating modes include different parameter values for one or moreparameters used for operating the ultrasound device. For example, insome embodiments, different configuration profiles may specify differentazimuth aperture values, elevation aperture values, azimuth focusvalues, elevation focus values, transducer bias voltage values, transmitpeak-to-peak voltage values, transmit center frequency values, receivecenter frequency values, polarity values, ADC clock rate values,decimation rate values, and/or receive duration values. It should beappreciated that other parameters may be used in the configurationprofiles, such as receive start time, receive offset, transmit spatialamplitude, transmit waveform, pulse repetition interval, axialresolution, lateral resolution at focus, elevational resolution atfocus, and signal gain. It should be appreciated that two differentconfiguration profiles for two different operating modes may differ inany suitable number of parameter values (e.g., at least one parametervalue, at least two parameter values, at least five parameter values,etc.), as aspects of the technology described herein are not limited inthis respect. The configuration profiles may differ in one or more ofthe above-described parameter values and/or any other suitable parametervalues. Examples of parameter values for different operating modes areprovided in Tables 2-4 below. Each of the rows of the Tables 2-4indicates illustrative parameter values for a particular configurationprofile associated with a respective operating mode.

As one example, a first configuration profile for a first operating modemay specify a first azimuth aperture value and a second configurationprofile for a second operating mode may specify a second azimuthaperture value different from the first azimuth aperture value. Asanother example, a first configuration profile for a first operatingmode may specify a first elevation aperture value and a secondconfiguration profile for a second operating mode may specify a secondelevation aperture value different from the first elevation aperturevalue. The azimuth and elevation aperture values for an operating modemay control the size of the active aperture of the transducer array inthe ultrasound probe. The physical aperture of the array, which isdetermined by the width and height of the array, may be different fromthe active aperture of the array as used in a particular operating mode.Indeed, the transducer arrangement may be configured to provide multiplepossible active apertures. For example, only some of the transducers maybe used for transmitting/receiving ultrasound signals, which results inthe active aperture of the array being different from what the aperturewould be if all the ultrasound transducers were used. In someembodiments, the azimuth and elevation aperture values may be used todetermine which subset of transducer elements are to be used fortransmitting/receiving ultrasound signals. In some embodiments, theazimuth and elevation aperture values may indicate, as a function oflength, an extent of the transducer array used in the azimuthal andelevational orientations, respectively.

As another example, a first configuration profile for a first operatingmode may specify a first azimuth focus value and a second configurationprofile for a second operating mode may specify a second azimuth focusvalue different from the first azimuth focus value. As another example,a first configuration profile for a first operating mode may specify afirst elevation focus value and a second configuration profile for asecond operating mode may specify a second elevation focus valuedifferent from the first elevation focus value. The azimuthal andelevational focus values may be used to control the focal point of thetransducer array independently in two dimensions. As such, differentfoci may be selected for the elevation and azimuthal dimensions. Thefocal point may be varied as between different operating modes eitherindependently or together. The azimuth and elevation focus values may beused to control the programmable delay mesh circuitry in order tooperate the ultrasound probe to have the focal point defined by theazimuth and elevation focus values.

As another example, a first configuration profile for a first operatingmode may specify a first bias voltage value (for biasing the voltageacross one or more ultrasonic transducers of the ultrasound probe) and asecond configuration profile for a second operating mode may specify asecond bias voltage value different from the first bias voltage value.As described herein, ultrasonic transducers may operate in collapsedmode or in non-collapsed mode. In some embodiments, application of atleast a threshold bias voltage (a “collapse” voltage) across one or moreultrasound transducers may cause these transducers to operate incollapsed mode.

As another example, a first configuration profile for a first operatingmode may specify a first transmit peak-to-peak voltage value (e.g., thevoltage value for the electrical signal representing the transmitwaveform) and a second configuration profile for a second operating modemay specify a second transmit peak-to-peak voltage value different fromthe first transmit peak-to-peak voltage value. The transmit peak-to-peakvoltage value may represent the peak-to-peak voltage swing in amplitude(in Volts) for the transducer driver. Different peak-to-peak voltageswings may be used in different operating modes. For example, anoperating mode for near-field imaging may use a smaller peak-to-peakvoltage swing (than what might be used in other operating modes) toprevent saturating the receivers in the near-field range. A highervoltage peak-to-peak voltage swing may be used for deeper imaging, forgeneration of tissue harmonics, or for imaging with diverging or planewaves, for example.

As another example, a first configuration profile for a first operatingmode may specify a first transmit center frequency value (e.g., thecenter frequency of an ultrasound signal transmitted by the ultrasoundtransducers) and a second configuration profile for a second operatingmode may specify a second transmit center frequency value different fromthe first transmit center frequency value. In some embodiments, thedifference between the first and second center frequencies may be atleast 1 MHz, at least 2 MHz, between 5 MHz and 10 MHz. In someembodiments, the first center frequency value may be within the 1-5 MHzrange and the second center frequency value may be within the 5-9 MHzrange. In some embodiments, the first center frequency value may bewithin the 2-4 MHz range and the second center frequency value may bewithin the 6-8 MHz range.

As another example, a first configuration profile for a first operatingmode may specify a first receive center frequency value (e.g., thecenter frequency of an ultrasound signal received by the ultrasoundtransducers) and a second configuration profile for a second operatingmode may specify a second receive center frequency value different fromthe first receive center frequency value. In some embodiments, aconfiguration profile may specify a transmit center frequency value thatis equal to the receive center frequency value. In other embodiments, aconfiguration profile may specify a transmit center frequency value thatis not equal to the receive center frequency value. For example, thereceive center frequency value may be a multiple of the transmitfrequency value (e.g., may be twice the transmit frequency value as thecase may be in the context of harmonic imaging). In some embodiments,the transducers may be capable of harmonic imagining using variouspressure within about 0.1 to 1 MPa (including any value within thatrange) over a range of about 5 to 15 cm. The pressure may induce aharmonic vibration in the tissue, and the receiver may receive thesignal at the harmonic mode and/or filter out the fundamental frequency.

As another example, a first configuration profile for a first operatingmode may specify a first polarity value and a second configurationprofile for a second operating mode may specify a second polarity valuedifferent from the first receive center frequency value. In someembodiments, the polarity parameter may indicate whether to operate thepulsers (e.g., pulser 208) in the transmit chain in unipolar mode or inbipolar mode. Operating pulsers in bipolar mode may be advantageous asit results in lower second harmonic distortion for some tissues. On theother hand, operating pulsers in unipolar mode may provide for greatertransducer acoustic power for certain bias voltages.

As another example, a first configuration profile for a first operatingmode may specify a first ADC clock rate value (e.g., the clock rate atwhich to operate one or more analog-to-digital converters on theultrasound device) and a second configuration profile for a secondoperating mode may specify a second ADC clock rate value different fromthe first ADC clock rate value. The ADC clock rate value may be used toset the rate at which to operate one or more ADCs in the receivecircuitry of the ultrasound probe (e.g., ADC 212 part of receivecircuitry 106 shown in FIG. 2).

As another example, a first configuration profile for a first operatingmode may specify a first decimation rate value and a secondconfiguration profile for a second operating mode may specify a seconddecimation rate value different from the first decimation rate value. Insome embodiments, the decimation rate value may be used to set the rateof decimation performed by one or more components in the receivecircuitry of the ultrasound probe. The decimation rate value and the ADCclock rate value together determine the bandwidth of the receiver in anoperating mode, which bandwidth in turn defines the axial resolution ofthe operating mode. In addition, the ratio of the ADC rate and thedecimation rate provides the effective sampling rate of the receiver inthe operating mode.

As another example, a first configuration profile for a first operatingmode may specify a first receive duration value and a secondconfiguration profile for a second operating mode may specify a secondreceive duration value different from the first receive duration value.The receive duration value indicates a length of time over which areceiver acquires samples.

In some embodiments, an ultrasound probe may be configured to operate inan operating mode for cardiac imaging, an operating mode for abdominalimaging, an operating model for kidney imaging, an operating mode forliver imaging, an operating mode for ocular imaging, an operating modefor imaging the carotid artery, an operating mode for imaging theinterior vena cava, and/or an operating mode for small parts imaging. Insome embodiments, an ultrasound probe may be configured to operate in atleast some (e.g., at least two, at least three, at least five, all) ofthese operating modes such that a user may use a single ultrasound probeto perform multiple different types of imaging. This allows a singleultrasound probe to perform imaging tasks that, conventionally, could beaccomplished by using only multiple different ultrasound probes.

In some embodiments, a user may select an operating mode for anultrasound probe through a graphical user interface presented by amobile computing device (e.g., a smartphone) coupled to the ultrasoundprobe (via a wired or a wireless connection). For example, the graphicaluser interface may present the user with a menu of operating modes(e.g., as shown in FIGS. 12A and 12B) and the user may select (e.g., bytapping on a touchscreen, clicking with a mouse, etc.) one of theoperating modes in the graphical user interface. In turn, the mobilecomputing device may provide an indication of the selected operatingmode to the ultrasound device. The ultrasound device may obtain aconfiguration profile associated with the selected operating mode (e.g.,by accessing it in a memory on the ultrasound device or receiving itfrom the mobile computing device) and use the parameter values specifiedtherein to operate in the selected operating mode.

In some embodiments, the ultrasound device may provide, to the mobilecomputing device, data obtained through operation in a particularoperating mode. The mobile computing device may process the receiveddata to generate one or more ultrasound images and may present thegenerated ultrasound image(s) to the user through the display of themobile computing device.

In some embodiments, the plurality of ultrasonic transducers includes aplurality of metal oxide semiconductor (MOS) ultrasonic transducers(e.g., CMOS ultrasonic transducers). In some embodiments, a MOSultrasonic transducer may include a cavity formed in a MOS wafer, with amembrane overlying and sealing the cavity. In some embodiments, theplurality of ultrasonic transducers includes a plurality ofmicromachined ultrasonic transducers (e.g., capacitive micromachinedultrasonic transducers). In some embodiments, the plurality ofultrasonic transducers includes a plurality of piezoelectric ultrasonictransducers.

In some embodiments, a selection of an operating mode may be provided toa handheld ultrasound probe through a mobile computing device coupled(e.g., via a wired connection) to the ultrasound probe. In otherembodiments, the selection of an operating mode may be provided to theultrasound probe directly. For example, the ultrasound probe maycomprise a mechanical control mechanism (e.g., a switch, a button, awheel, etc.) for selecting an operating mode. As another example, theultrasound probe may comprise a display (e.g., as shown in FIGS. 6A-B)and use the display to present a GUI to a user through which the usermay select an operating mode for the ultrasound probe.

FIG. 9 is a diagram illustrating how a universal ultrasound device maybe used to image a subject, in accordance with some embodiments of thetechnology described herein. In particular, FIG. 9 shows an illustrativeultrasound system 900 comprising an ultrasound device 902communicatively coupled to computing device 904 via communication link912. The ultrasound device 902 may be used to image subject 901 in anyof a plurality of operating modes, examples of which are providedherein.

In some embodiments, the operating mode in which to operate ultrasounddevice 902 may be selected by a user of computing device 904. Forexample, in the illustrated embodiment, computing device 904 comprises adisplay 906 and is configured to present, via display 906, a graphicaluser interface comprising a menu 910 of different operating modes(further examples are shown in FIGS. 12A-B). The graphical userinterface may comprise a GUI element (e.g., an icon, an image, text,etc.) for each of the operating modes that may be selected. A user mayselect one of the displayed menu options by tapping the screen of thecomputing device (when the display comprises a touch screen), using amouse, a keyboard, voice input, or in any other suitable way. Afterreceiving the user's selection, the computing device 904 may provide anindication of the selected operating mode to the ultrasound device 902via communication link 912.

In some embodiments, responsive to receiving an indication of a selectedoperating mode from computing device 904, ultrasound device 902 mayaccess a configuration profile associated with the operating mode. Theconfiguration profile may specify values of one or more parameters,which are to be used for configuring the ultrasound probe to function inthe selected operating mode. Examples of such parameter values areprovided herein.

In some embodiments, the configuration profile for the selected mode maybe stored onboard ultrasound probe 902 (e.g., in the configurationprofile memory 1302 shown in FIG. 13). In other embodiments, theconfiguration profile for the selected mode may be provided, viacommunication link 912, to the ultrasound probe from the computingdevice 904. In yet other embodiments, one or more of the parametervalues of a configuration mode may be stored onboard the ultrasoundprobe and one or more other parameter values of the configuration modemay be provided, via communication link 912, to the ultrasound probefrom the computing device 904.

In some embodiments, data obtained by the ultrasound device 902 duringoperation in a particular operating mode may be provided, viacommunication link 912, to computing device 904. The computing device904 may process the received data to generate one or more ultrasoundimages and display the generated ultrasound image(s) via display 906(e.g., as shown in FIG. 14).

In some embodiments, ultrasound probe 902 may be a handheld ultrasoundprobe of any suitable type described herein including, for example, theultrasound probe illustrated in FIG. 8. In some embodiments, thehandheld ultrasound probe may comprise a display and, for example, maybe an ultrasound probe of the kind illustrated in FIGS. 6A-6B (in suchembodiments, some or all of the functionality performed by the computingdevice 904 may be performed onboard the ultrasound probe). In otherembodiments, ultrasound probe 902 may be a wearable ultrasound probeand, for example, may be a skin-mountable ultrasound patch such as thepatch illustrated in FIGS. 7A-7D.

FIG. 13 shows a block diagram of ultrasound device 902, in someembodiments. As shown in FIG. 13, ultrasound device 902 may includecomponents shown and described with reference to FIG. 1B including, oneor more transducer arrangements (e.g., arrays) 102, transmit (TX)circuitry 104, receive (RX) circuitry 106, a timing & control circuit108, a signal conditioning/processing circuit 110, a power managementcircuit 118, and/or a high-intensity focused ultrasound (HIFU)controller 120. In the embodiment shown, all of the illustrated elementsare formed on a single semiconductor die 112. It should be appreciated,however, that in alternative embodiments one or more of the illustratedelements may be instead located off-chip.

Additionally, as shown in the embodiment of FIG. 13, ultrasound device902 may comprise a configuration profile memory 1302, which may storeone or more configuration profiles for a respective one or moreoperating modes. For example, in some embodiments, configuration profilememory 1302 may store parameter values for each of one or moreconfiguration profiles. In some embodiments, control circuitry (e.g.,circuitry 108) may be configured to access, in the configuration profilememory 1302, parameter values for a selected configuration profile andconfigure one or more other components of the ultrasound probe (e.g.,transmit circuitry, receive circuitry, ultrasound transducers, etc.) tooperate in accordance with the accessed parameter values.

In some embodiments, computing device 904 may be a portable device. Forexample, computing device 904 may be a mobile phone, a smartphone, atablet computer, or a laptop. The computing device 904 may comprise adisplay, which may be of any suitable type, and/or may becommunicatively coupled to a display external to the computing device904. In other embodiments, the computing device 904 may be a fixeddevice (e.g., a desktop computer, a rackmount computer, etc.).

In some embodiments, communication link 912 may be a wired link. Inother embodiments, communication link 912 may be a wireless link (e.g.,a Bluetooth or Wi-Fi connection).

FIG. 10 is a flowchart of an illustrative process 1000 for operating auniversal ultrasound device, in accordance with some embodiments of thetechnology described herein. Illustrative process 1000 may be performedby any suitable device(s) and, for example, may be performed byultrasound device 902 and computing device 904 described with referenceto FIG. 9. As another example, in some embodiments, an ultrasound devicemay perform all acts of process 1000.

Process 1002 begins at act 1002, where a graphical user interface (GUI)showing multiple operating modes is shown on a display. The display maybe part of a computing device communicatively coupled to an ultrasoundprobe (e.g., the display a mobile smartphone). The GUI may include a GUIelement (e.g., an icon, an image, a text portion, a menu item, etc.) foreach of the multiple operating modes. In some embodiments, each GUIelement representing an operating may be selectable by a user, forexample, through tapping with a finger or stylus (when the display is atouchscreen) and/or clicking. Additionally or alternatively, a GUIelement may be selected through keyboard input and/or voice input, asaspects of the technology described herein are not limited in thisrespect.

In some embodiments, the GUI may be generated by an application programexecuting on the computing device. For example, the GUI may be generatedby application program “app” executing on a mobile smartphone. Theapplication program may be configured to not only generate and displaythe GUI, but also receive a user's selection of the operating mode atact 1004 and provide an indication of the user's selection to theultrasound device at act 1006. Additionally, in some embodiments, theapplication program may be configured to receive data gathered by theultrasound device, generate one or more ultrasound images using thedata, and display the generated ultrasound image(s) using the display ofthe mobile computing device. In other embodiments, the applicationprogram may receive ultrasound image(s) generated onboard an ultrasounddevice (rather than generating the ultrasound image(s) itself) anddisplay them.

FIG. 11 shows an example GUI 1100 that may be displayed as part of act1002. The GUI 1100 comprises a first portion 1102 containing GUIelements 1104, 1106, 1108, and 1110 representing different operatingmodes. Although the GUI 1100 shows a menu of four operating modes, thisis merely for illustration and not by way of limitation, as a GUI mayshow any suitable number of operating modes. Furthermore, in someembodiments, a GUI may show some of the operating modes and allow theuser to reveal additional operating modes, for example, by scrolling ornavigating the GUI in any other suitable way. The illustrative GUI 1100also comprises a second portion 1112 showing a GUI element correspondingto the “Cancel” option, which allows a user to not select any of theoperating modes shown in first portion 1102.

FIG. 12A shows another example GUI 1202 that may be displayed as part ofact 1002. The GUI 1202 comprises multiple selectable GUI elementscorresponding to respective operating modes including GUI elements 1204,1206, 1208, 1210, and 1212 corresponding, respectively, to operatingmodes for performing abdominal imaging, small parts imaging, cardiacimaging, lung imaging, and ocular imaging. The “Shop Presets” GUIelement 1214 allows a user to download (e.g., through a purchase) one ormore configuration profiles for additional operating mode(s). After theadditional configuration profiles are downloaded, they may be used tocontrol the ultrasound device to operate in the additional operatingmode(s). GUI 1202 also includes a GUI element 1216 corresponding to the“Cancel” option, which may allow a user to not select any of theoperating modes shown in GUI 1202.

Additionally, as shown in FIG. 12A, GUI 1202 includes an operating modeindicator 1218, which indicates a highlighted operating mode. As theuser scrolls through different operating modes (e.g., by swiping along atouch screen, scrolling using a mouse or keyboard, etc.) differentoperating modes may be highlighted by operating mode indicator 1218. Auser may select a highlighted operating mode (e.g., by tapping,clicking, etc.). In response, the GUI may provide the user with a visualconfirmation of his/her selection. For example, as shown in FIG. 12B,after a user selects the cardiac operating mode, the GUI provides avisual confirmation of the user's selection by changing the color of theoperating mode indicator. It should be appreciated that an operatingmode indicator need not be implemented through a colored box or othershape surrounding text identifying the mode. For example, in someembodiments, an operating mode indicator may be provided by underliningtext, changing text size, changing font size, italicizing text, and/orin any other suitable way. While in some embodiments the operating modeindicator may be visual, in yet other embodiments, the operating modeindicator may be provided as an audio indicator (e.g., through playbackof recorded or synthesized speech indicating the operating mode).Similarly, a visual confirmation of a selection may be provided to theuser in any suitable way and, in some embodiments, an audio confirmationmay be provided in addition to or instead of the visual confirmation.

After the GUI is displayed at act 1002, process 1000 proceeds to act1004 where a user's selection of the operating mode is received (e.g.,by computing device 904), as a result of the user selecting one of theoperating modes. As discussed, the user may select one of the operatingmodes through the GUI by using a touchscreen, mouse, keyboard, voiceinput, and/or any other suitable way. The GUI may provide the user witha visual confirmation of the selection.

Next, process 1000 proceeds to act 1006, where an indication of theselected operating mode is provided to the ultrasound device. Forexample, an indication of the selected operating mode may be provided bycomputing device 904 to ultrasound device 902. The indication may beprovided in any suitable format, as aspects of the technology are notlimited in this respect. In some embodiments, the indication may includeat least a portion (e.g., all of) a configuration profile associatedwith the selected operating modes. For example, the indication mayinclude one or more parameter values for the selected operating mode. Inother embodiments, however, the indication may include informationidentifying the selected operating mode, but not include any of theparameter values for the mode, which parameter values may be storedonboard the ultrasound device.

Next, at act 1008, the ultrasound device obtains a configuration profilefor the selected operating mode. In some embodiments, the configurationprofile may be stored in at least one memory onboard the ultrasounddevice (e.g., configuration profile memory 1302 shown in FIG. 13). Inother embodiments, at least some of the configuration profile (e.g., atleast some of the parameter values) may be provided to the ultrasoundprobe from an external device (e.g., computing device 904 may transmitto ultrasound probe 902 at least some or all of the configurationprofile for the selected operating mode).

Next, at act 1010, the parameter values in the obtained configurationprofile may be used to configure the ultrasound device to operate in theselected mode. To this end, the parameter values may be used toconfigure one or more components of the ultrasound device and, to thisend, may be loaded into one or more registers, memories, and the like,from which locations they may be utilized by ultrasound probe circuitryduring operation in the selected operating mode.

Next, at act 1012, the ultrasound device may be operated in the selectedoperating mode using the parameter values specified in the configurationprofile for the selected operating mode. For example, in someembodiments, control circuitry of an ultrasound device (e.g., controlcircuitry 108 shown in FIG. 13) may control one or more components ofthe ultrasound probe (e.g., waveform generator, programmable delay meshcircuitry, transmit circuitry, receive circuitry, etc.) using theparameter values specified in the configuration profile.

As described herein, data obtained by an ultrasound probe may beprocessed to generate an ultrasound image. In some embodiments, dataobtained by an ultrasound probe may be provided to a computing device(e.g., computing device 904) and processed to generate one or moreultrasound images. In turn, the ultrasound image(s) may be presented toa user through a display of the computing device.

FIG. 14 shows an example of a graphical user interface 1400 configuredto show one or more ultrasound images (e.g., a single ultrasound image,a series or movie of ultrasound images) to a user. In the example ofFIG. 14, the GUI 1400 displays ultrasound images in image portion 1406.In addition to an ultrasound image, the GUI 1400 may include othercomponents such as status bar 1402, scale 1404, and selectable options1408, 1410, and 1412.

In some embodiments, the status bar 1402 may display information aboutthe state of the ultrasound device such as, for example, the operatingfrequency and/or a battery life indicator. In some embodiments, thescale 1404 may show a scale for the image portion 1406. The scale 1404may show a scale for the image portion 1406. The scale 1404 maycorrespond to depth, size, or any other suitable parameter for displaywith the image portion 1406. In some embodiments, the image portion 1406may be displayed without the scale 1404.

In some embodiments, the selectable option 1408 may allow a user toaccess one or more preset operating modes, selected from one or moreoperating modes of the ultrasound device. The selectable option 1410 mayallow the user to take a still image of the image portion 1406. Theselectable option 1412 may allow the user to record a video of the imageportion 1406. The selectable option 1414 may allow a user to access anyor all of the operating modes of the ultrasound device. In someembodiments, any or all of the selectable options 1408, 1410, 1412, and1414 may be displayed, while in other embodiments none of them may bedisplayed.

As described above, in some embodiments, an ultrasound probe may beoperated in one of multiple operating modes each of which is associatedwith a respective configuration profile. A configuration profile for anoperating mode may specify one or more parameter values used by theultrasound probe to function in the operating mode. Tables 2-4 shownbelow illustrate parameter values in configuration profiles for aplurality of illustrative operating modes. The parameter values for aparticular configuration profile are shown in a particular row acrossall three tables (a single table showing all the parameter values wassplit into three tables for ease of presentation, with the first twocolumns repeated in each table to simplify cross-referencing.)Accordingly, each row in Tables 2-4 specifies parameter values of aconfiguration profile for a particular operating mode. For example,parameter values for an operating mode for abdominal imaging may befound in the first row of Table 2, the first row of Table 3 and thefirst row of Table 4. As another example, parameter values for anoperating mode for thyroid imaging may be found in the last row of Table2, the last row of Table 3, and the last row of Table 4.

As may be appreciated from Tables 2-4, while some parameter valueschange across multiple modes, some parameter values may be the same inmultiple modes, as not all parameter values for different modes differfrom one another. However, one or more parameter values are differentfor any two given operating modes. It should be appreciated that thevalues shown in Tables 2-4 are examples of possible parameters. Anyrange of values suitable for the operating modes is possible; forexample for any of the values listed, alternative values within +/−20%may be used.

Table 2 illustrates parameter values for multiple operating modes,including: (1) parameter values for the “TX Frequency (Hz)” parameter,which indicate transmit center frequency values and, in this example,are specified in Hertz; (2) parameter values for the “TX # cycles”parameter, which may indicate the number of transmit cycles used by thetransducer array; (3) parameter values for the “TX Az. Focus (m)”parameter, which may indicate the azimuth focus values and, in thisexample, are specified in meters; (4) parameter values for the “TX El.Focus (m)” parameter, which may indicate elevation focus values and, inthis example, are specified in meters; (5) parameter values for the “TXAz. F#” parameter, which may indicate the F numbers of the transmitterazimuth (and may be obtained by dividing the azimuth focus value by theazimuth aperture value); (6) parameter values for the “TX El. F#”parameter, which may indicate the F numbers of the transmitter elevation(and may be obtained by dividing the elevation focus value by theazimuth aperture value); and (7) parameter values for the “TX Az.Aperture (m)” parameter, which may indicate azimuth aperture values and,in this example, are specified in meters. In some embodiments the “TXAz. Aperture” parameter may have a range of 1.8-3.5 cm (e.g., 1.9-3.4 cmor 2.0-3.3 cm). Table 2 also includes a column for “TX El. Aperture (m)”which is duplicated in Table 3 for purposes of simplicity, and describedfurther below in connection with Table 3.

TABLE 2 Illustrative parameter values for configuration profilesassociated with different operating modes. TX Az. TX El. TX El. TX #Focus Focus TX Az. TX El. TX Az. Aperture Preset Name TX Frequency (Hz)cycles (m) (m) F# F# Aperture (m) (m) abdomen 3500000 1 0.1 0.07 4 50.025 0.013 abdomen_thi 1750000 1 0.1 0.07 4 5 0.025 0.013abdomen_vascular 2800000 2 0.18 INF 2 INF 0.028 0.013abdomen_vascular_thi 1600000 1 0.08 INF 2 INF 0.028 0.013 cardiac2300000 2 0.14 INF 3 INF 0.028 0.013 cardiac_thi 1500000 2 0.06 INF 3INF 0.020 0.013 carotid 8100000 2 0.045 0.06 4 18 0.011 0.003carotid_flow 4000000 4 INF 0.1 1 1 0.028 0.013interleave_cardiac_flow_bmode 3000000 1 INF 0.09 2 2 0.028 0.013interleave_cardiac_flow_color 2000000 4 INF 0.1 2 7.5 0.028 0.013interleave_carotid_flow_bmode 7500000 2 INF 0.06 2 9 0.028 0.007interleave_carotid_flow_color 4000000 4 INF 0.05 1 1 0.028 0.013 joint7000000 1 INF 0.03 1 6.5 0.028 0.005 joint_power 4000000 4 INF 0.01 10.75 0.028 0.013 m_mode 4000000 1 INF 0.03 2 2 0.028 0.013 msk 6200000 2INF 0.03 2 6.5 0.028 0.005 msk_superficial 8300000 1 0.02 0.02 0.0050.004 obstetric 3500000 1 0.14 0.09 4 5 0.028 0.013 patch_kidney 30000002 INF 0.06 2 2 0.028 0.013 thyroid 7500000 2 0.045 0.035 4 2.5 0.0110.013

Table 3 illustrates additional parameter values for the multipleoperating modes, including: (1) parameter values for the “TX El.Aperture (m)” parameter, which may indicate elevation aperture valuesand, in this example, are specified in meters. In some embodiments theTX El. Aperture parameter may have a range of 1.5-2.5 cm (e.g.,1.75-2.25 cm).; (2) parameter values for the “Bias Voltage (V)”parameter, which may indicate transducer bias voltage values and, inthis example, are specified in Volts; (3) parameter values for the “TXPk-Pk. Voltage (V)”, which may indicate transmit peak-to-peak voltagevalues and, in this example, are specified in Volts; and (4) parametervalues for the “Bipolar?” parameter, which may indicate to polarityvalues, which in this example are either unipolar or bipolar.

TABLE 3 Illustrative parameter values (for additional parameters) in theconfiguration profiles of Table 2. TX Pk-Pk. Preset Name TX Frequency(Hz) TX El. Aperture (m) Bias Voltage (V) Voltage (V) Bipolar? abdomen3500000 0.013 70 31 TRUE abdomen_thi 1750000 0.013 70 38 FALSEabdomen_vascular 2800000 0.013 60 40 TRUE abdomen_vascular_thi 16000000.013 60 40 TRUE cardiac 2300000 0.013 60 31 TRUE cardiac_thi 15000000.013 60 40 TRUE carotid 8100000 0.003 80 20 TRUE carotid_flow 40000000.013 80 41 TRUE interleave_cardiac_flow_bmode 3000000 0.013 48 31 FALSEinterleave_cardiac_flow_color 2000000 0.013 48 31 FALSEinterleave_carotid_flow_bmode 7500000 0.007 80 41 TRUEinterleave_carotid_flow_color 4000000 0.013 80 41 TRUE joint 70000000.005 90 18 FALSE joint_power 4000000 0.013 90 16 FALSE m_mode 40000000.013 60 31 FALSE msk 6200000 0.005 90 18 FALSE msk_superficial 83000000.004 90 20 TRUE obstetric 3500000 0.013 70 31 TRUE patch_kidney 30000000.013 60 25 FALSE thyroid 7500000 0.013 80 20 TRUE

Table 4 illustrates additional parameter values for the multipleoperating modes, including: (1) parameter values for the “RX Frequency(Hz)” parameter, which may indicate receive center frequency values and,in this example, are specified in Hertz; (2) parameter values for the“ADC Rate (Hz)” parameter, which may indicate ADC clock rate values and,in this example, are specified in Hertz; (3) parameter values for the“Decimation Rate” parameter, which may indicate decimation rate values;(4) parameter values for the “Bandwidth (Hz)” parameter, which mayindicate bandwidths of the receiver and, in this example, are specifiedin Hertz; (5) parameter values for the “Low (Hz)” parameter and for the“High (Hz)” parameter, which respectively indicate the low and highcutoffs of the operating frequency range and, in this example, arespecified in Hertz; (6) parameter values for the “RX Depth (m)”parameter, which may be provided in meters; and (7) parameters valuesfor the “RX Duration (us)” parameter, which may indicate receiverduration values and, in this example, are specified in microseconds.

TABLE 4 Illustrative parameter values (for more additional parameters)in the configuration profiles of Table 2. TX Rx ADC Frequency FrequencyRate Decimation Bandwidth RX Depth RX Duration Preset Name (Hz) (Hz)(Hz) Rate (MHz) Low (Hz) High (Hz) (m) (us) abdomen 3500000 350000025000000 4 3125000 1937500 5062500 0.12 80.0 abdomen_thi 1750000 350000025000000 4 3125000 1937500 5062500 0.12 80.0 abdomen_vascular 28000002800000 25000000 6 2083333 1758333 3841667 0.15 100.0abdomen_vascular_thi 1600000 3200000 25000000 6 2083333 2158333 42416670.15 100.0 cardiac 2300000 2300000 25000000 6 2083333 1258333 33416670.15 100.0 cardiac_thi 1500000 3000000 25000000 6 2083333 19583334041667 0.15 100.0 carotid 8100000 8100000 25000000 3 4166667 601666710183333 0.04 26.7 carotid_flow 4000000 4000000 25000000 8 15625003218750 4781250 0.04 26.7 interleave_cardiac_flow_bmode 3000000 300000025000000 16 781250 2609375 3390625 0.035 23.3interleave_cardiac_flow_color 2000000 2000000 25000000 16 781250 16093752390625 0.035 23.3 interleave_carotid_flow_bmode 7500000 750000025000000 5 2500000 6250000 8750000 0.16 106.7interleave_carotid_flow_color 4000000 4000000 25000000 9 1388889 33055564694444 0.16 106.7 joint 7000000 7000000 25000000 3 4166667 49166679083333 0.03 20.0 joint_power 4000000 4000000 25000000 5 2500000 27500005250000 0.025 16.7 m_mode 4000000 4000000 25000000 8 1562500 32187504781250 0.15 100.0 msk 6200000 6200000 25000000 3 4166667 41166678283333 0.04 26.7 msk_superficial 8300000 8300000 25000000 2 62500005175000 11425000 0.02 13.3 obstetric 3500000 3500000 25000000 4 31250001937500 5062500 0.15 100.0 patch_kidney 3000000 3000000 25000000 91388889 2305556 3694444 0.11 73.3 thyroid 7500000 7500000 25000000 43125000 5937500 9062500 0.04 26.7

As previously described, different resolutions may be achieved orprovided with the different operating modes, in at least someembodiments. For example, the operating modes reflected in Tables 2-4may provide axial resolutions ranging between 300 μm and 2,000 μm,including any value within that range, as well as other ranges. The sameoperating modes may provide lateral resolution at the focus between 200μm and 5,000 μm, including any value within that range, as well as otherranges. The same operating modes may provide elevational resolution atthe focus between 300 μm and 7,000 μm, including any value within thatrange, as well as other ranges. As a non-limiting example, the first“abdomen” mode may provide an axial resolution of approximately 400 μm,a lateral resolution at focus of approximately 2,000 μm, and anelevational resolution at focus of approximately 2,700 μm. By contrast,the “interleave_cardiac_flow_color” mode may provide an axial resolutionof approximately 1,700 μm, a lateral resolution at focus ofapproximately 900 μm, and an elevational resolution at focus ofapproximately 7,000 μm. These represent non-limiting examples.

As has been described, ultrasound devices (e.g., probes) according toaspects of the present application may be used in various modes withvarious associated frequency ranges and depths. Thus, ultrasound devicesaccording to the various aspects herein may be used to generatediffering ultrasound beams. To illustrate the point, variousnon-limiting examples are now described with respect to FIGS. 15-17. Theultrasound devices described herein may, in at least some embodiments,generate two or more ultrasound beam types (e.g., beam shapes) typicallyassociated with linear, sector, curvilinear (convex), and mechanicallyscanned (moved) probes. In at least some embodiments, an ultrasoundprobe according to aspects of the present application may generateultrasound beams typically associated with all of linear, sector,curvilinear, and mechanically scanned probes.

FIG. 15 shows one example of a beam shape for an ultrasound probeaccording to a non-limiting embodiment of the present application. Asillustrated in FIG. 15, the ultrasound probe may utilize a linear beamshape 1502 generated by the transducer array 1500. It should beappreciated that the beam shape 1502 may be based on accumulated azimuthtransmit intensities over a spatial region. By acquiring multipleelevational transmit angles and/or focuses and coherently summing them,the azimuthal beam shape can effectively become a narrow slice. Thedepth of the waist of the beam shape 1502 may be fixed at a locationthat is appropriate based on the attenuation of the frequency beingused. In some embodiments, a linear beam shape 1502 may be used at 3-7MHz, 5-12 MHz, or 7-15 MHz. The linear beam shape 1502 may providehigher resolution and shallower imaging at increasing frequencies.

FIG. 16 shows another example of a beam shape for an ultrasound probeaccording to a non-limiting embodiment. As illustrated in FIG. 16, theultrasound probe may utilize a sector beam shape 1602 generated by thetransducer array 1500. It should be appreciated that the beam shape 1602may be based on accumulated azimuth transmit intensities over a spatialregion. In some embodiments, a sector beam shape 1602 may be used at 1-3MHz, 2-5 MHz, or 3.6-10 MHz. These frequency ranges may be used forcardiac, abdominal, pelvic, or thoracic imaging, for example. In someembodiments, the sector beam shape 1602 may be suitable for deep tissueimaging.

FIG. 17 shows another example of a beam shape for an ultrasound probe.As illustrated in FIG. 17, the ultrasound probe may utilize a 3D beamshape 1702 generated by the transducer array 1500. It should beappreciated that the beam shape 1502 may be based on accumulated azimuthtransmit intensities over a spatial region. In some embodiments, a 3Dbeam shape 1702 may be used at 3.5-6.5 MHz or 7.5-11 MHz. In someembodiments the 3D beam shape 1702 may be a result of electronicallyscanning/sweeping either a sector or curvilinear profile, withoutmechanically scanning the probe. In some embodiments, the 3D beam shape1702 may be suitable for 3D volume imaging.

According to at least some embodiments of the present application, anultrasound probe may generate all the beam shapes shown in FIGS. 15-17,as well as potentially generating additional beam shapes. For example,transducer array 1500 may generate all the beam shapes shown in FIGS.15A-15C. Moreover, as has been described herein, the various modes ofoperation, and the various associated beam shapes, may be generated witha substantially flat ultrasonic transducer array. Thus, in at least someembodiments, beam shapes typically associated with a curvilineartransducer array may instead be achieved with a substantially flatultrasonic transducer arrangement.

Having thus described several aspects and embodiments of the technologyset forth in the disclosure, it is to be appreciated that variousalterations, modifications, and improvements will readily occur to thoseskilled in the art. Such alterations, modifications, and improvementsare intended to be within the spirit and scope of the technologydescribed herein. For example, those of ordinary skill in the art willreadily envision a variety of other means and/or structures forperforming the function and/or obtaining the results and/or one or moreof the advantages described herein, and each of such variations and/ormodifications is deemed to be within the scope of the embodimentsdescribed herein. Those skilled in the art will recognize, or be able toascertain using no more than routine experimentation, many equivalentsto the specific embodiments described herein. It is, therefore, to beunderstood that the foregoing embodiments are presented by way ofexample only and that, within the scope of the appended claims andequivalents thereto, inventive embodiments may be practiced otherwisethan as specifically described. In addition, any combination of two ormore features, systems, articles, materials, kits, and/or methodsdescribed herein, if such features, systems, articles, materials, kits,and/or methods are not mutually inconsistent, is included within thescope of the present disclosure.

The above-described embodiments can be implemented in any of numerousways. One or more aspects and embodiments of the present disclosureinvolving the performance of processes or methods may utilize programinstructions executable by a device (e.g., a computer, a processor, orother device) to perform, or control performance of, the processes ormethods. In this respect, various inventive concepts may be embodied asa computer readable storage medium (or multiple computer readablestorage media) (e.g., a computer memory, one or more floppy discs,compact discs, optical discs, magnetic tapes, flash memories, circuitconfigurations in Field Programmable Gate Arrays or other semiconductordevices, or other tangible computer storage medium) encoded with one ormore programs that, when executed on one or more computers or otherprocessors, perform methods that implement one or more of the variousembodiments described above. The computer readable medium or media canbe transportable, such that the program or programs stored thereon canbe loaded onto one or more different computers or other processors toimplement various ones of the aspects described above. In someembodiments, computer readable media may be non-transitory media.

The terms “program” or “software” are used herein in a generic sense torefer to any type of computer code or set of computer-executableinstructions that can be employed to program a computer or otherprocessor to implement various aspects as described above. Additionally,it should be appreciated that according to one aspect, one or morecomputer programs that when executed perform methods of the presentdisclosure need not reside on a single computer or processor, but may bedistributed in a modular fashion among a number of different computersor processors to implement various aspects of the present disclosure.

Computer-executable instructions may be in many forms, such as programmodules, executed by one or more computers or other devices. Generally,program modules include routines, programs, objects, components, datastructures, etc. that perform particular tasks or implement particularabstract data types. Typically the functionality of the program modulesmay be combined or distributed as desired in various embodiments.

Also, data structures may be stored in computer-readable media in anysuitable form. For simplicity of illustration, data structures may beshown to have fields that are related through location in the datastructure. Such relationships may likewise be achieved by assigningstorage for the fields with locations in a computer-readable medium thatconvey relationship between the fields. However, any suitable mechanismmay be used to establish a relationship between information in fields ofa data structure, including through the use of pointers, tags or othermechanisms that establish relationship between data elements. Whenimplemented in software, the software code can be executed on anysuitable processor or collection of processors, whether provided in asingle computer or distributed among multiple computers.

Further, it should be appreciated that a computer may be embodied in anyof a number of forms, such as a rack-mounted computer, a desktopcomputer, a laptop computer, or a tablet computer, as non-limitingexamples. Additionally, a computer may be embedded in a device notgenerally regarded as a computer but with suitable processingcapabilities, including a Personal Digital Assistant (PDA), a smartphoneor any other suitable portable or fixed electronic device.

Also, a computer may have one or more input and output devices. Thesedevices can be used, among other things, to present a user interface.Examples of output devices that can be used to provide a user interfaceinclude printers or display screens for visual presentation of outputand speakers or other sound generating devices for audible presentationof output. Examples of input devices that can be used for a userinterface include keyboards, and pointing devices, such as mice, touchpads, and digitizing tablets. As another example, a computer may receiveinput information through speech recognition or in other audibleformats.

Such computers may be interconnected by one or more networks in anysuitable form, including a local area network or a wide area network,such as an enterprise network, and intelligent network (IN) or theInternet. Such networks may be based on any suitable technology and mayoperate according to any suitable protocol and may include wirelessnetworks, wired networks or fiber optic networks.

The following non-limiting exemplary embodiments are provided toillustrate inventive aspects of the disclosure.

Example 1 is directed to an ultrasound device, comprising: an ultrasoundprobe, including a semiconductor die, and a plurality of ultrasonictransducers integrated on the semiconductor die, the plurality ofultrasonic transducers configured to operate in a first mode associatedwith a first frequency range and a second mode associated with a secondfrequency range, wherein the first frequency range is at least partiallynon-overlapping with the second frequency range; and control circuitryconfigured to: control the plurality of ultrasonic transducers togenerate and/or detect ultrasound signals having frequencies in thefirst frequency range, in response to receiving an indication to operatethe ultrasound probe in the first mode; and control the plurality ofultrasonic transducers to generate and/or detect ultrasound signalshaving frequencies in the second frequency range, in response toreceiving an indication to operate the ultrasound probe in the secondmode.

Example 2 is directed to the ultrasound device of example 1, wherein awidth of the first frequency range is at least 1 MHz and a width of thesecond frequency range is at least 1 MHz.

Example 3 is directed to the ultrasound device of example 1, wherein adifference between a first center frequency in the first frequency rangeand a second center frequency in the second frequency range is at least1 MHz.

Example 4 is directed to the ultrasound device of example 3, wherein thedifference is at least 2 MHz.

Example 5 is directed to the ultrasound device of example 4, wherein thedifference is between about 6 MHz and about 9 MHz.

Example 6 is directed to the ultrasound device of example 1, wherein thefirst frequency range is contained entirely within a range of 1-5 MHz.

Example 7 is directed to the ultrasound device of example 6, wherein thefirst frequency range is contained entirely within a range of 2-4 MHz.

Example 8 is directed to the ultrasound device of example 1, wherein thesecond frequency range is contained entirely within a range of 5-9 MHz.

Example 9 is directed to the ultrasound device of example 8, wherein thesecond frequency range is contained entirely within a range of 6-8 MHz.

Example 10 is directed to the ultrasound device of example 1, theplurality of ultrasonic transducers is further configured to operate ina third mode associated with a third frequency range that is at leastpartially non-overlapping with the first frequency range and the secondfrequency range, and wherein the control circuitry is further configuredto: control the plurality of ultrasonic transducers to generate and/ordetect ultrasound signals having frequencies in the third frequencyrange, in response to receiving an indication to operate the ultrasoundprobe in the third mode.

Example 11 is directed to the ultrasound device of example 10, whereinthe first frequency range is contained entirely within a range of 1-3MHz, the second frequency range is contained entirely within a range of3-7 MHz, and the third frequency range is contained entirely within arange of 7-15 MHz.

Example 12 is directed to the ultrasound device of example 1, wherein:when the plurality of ultrasonic transducers are controlled to detectultrasound signals having frequencies in the first frequency range,ultrasound signals detected by the plurality of ultrasonic transducersare used to form an image of a subject up to a first depth within thesubject; and when the plurality of ultrasonic transducers are controlledto detect ultrasound signals having frequencies in the second frequencyrange, ultrasound signals detected by the plurality of ultrasonictransducers are used to form an image of a subject up to a second depthwithin the subject, wherein the second depth is smaller than the firstdepth.

Example 13 is directed to the ultrasound device of example 12, whereinthe first depth is contained within a range of up to 8-25 cm from asurface of the subject.

Example 14 is directed to the ultrasound device of example 13, whereinthe first depth is contained within a range of up to 15-20 cm from thesurface of the subject.

Example 15 is directed to the ultrasound device of example 12, whereinthe second depth is contained within a range of up to 3-7 cm from asurface of the subject.

Example 16 is directed to the ultrasound device of example 1, whereinthe plurality of ultrasound transducers are capacitive ultrasonictransducers, and wherein the control circuitry is configured to controlthe plurality of ultrasonic transducers to generate and/or detectultrasound signals having frequencies in the second frequency range atleast in part by causing the plurality of ultrasonic transducers tooperate in a collapsed mode, in which at least one portion of a membraneof the plurality of ultrasonic transducers is mechanically fixed and atleast one portion of the membrane is free to vibrate based on a changingvoltage differential between an electrode and the membrane.

Example 17 is directed to the ultrasound device of example 1, whereinthe control circuitry is configured to: cause a first voltage to beapplied to the plurality of ultrasonic transducers in response to theindication to operate the ultrasound probe in the first frequency range;and cause a second voltage to be applied to the plurality of ultrasonictransducers in response to the indication to operate the ultrasoundprobe in the second frequency range, wherein the second voltage ishigher than the first voltage.

Example 18 is directed to the ultrasound device of example 17, whereinthe second voltage is greater than a collapse voltage for the pluralityof ultrasonic transducers, the collapse voltage comprising a voltagewhich causes a membrane of an ultrasonic transducers to make contact toa bottom of a cavity of the ultrasonic transducer.

Example 19 is directed to the ultrasound device of example 18, whereinthe collapse voltage is at least 30 Volts.

Example 20 is directed to the ultrasound device of example 1, whereinthe plurality of ultrasonic transducers includes multiple ultrasonictransducers at least one of which is configured to generate ultrasoundsignals in the first frequency range and in the second frequency range.

Example 21 is directed to the ultrasound device of example 1, whereinthe plurality of ultrasonic transducers includes a plurality of CMOSultrasonic transducers.

Example 22 is directed to the ultrasound device of example 21, whereinthe plurality of CMOS ultrasonic transducers includes a first CMOSultrasonic transducer including a cavity formed in a CMOS wafer, with amembrane overlying and sealing the cavity.

Example 23 is directed to the ultrasound device of example 1, whereinthe plurality of ultrasonic transducers includes a plurality ofmicromachined ultrasonic transducers.

Example 24 is directed to the ultrasound device of example 23, whereinthe plurality of micromachined ultrasonic transducers includes aplurality of capacitive micromachined ultrasonic transducers.

Example 25 is directed to the ultrasound device of example 23, whereinthe plurality of micromachined ultrasonic transducers includes aplurality of piezoelectric ultrasonic transducers.

Example 26 is directed to the ultrasound device of example 1, whereinthe ultrasound probe further comprises a handheld device.

Example 27 is directed to the ultrasound device of example 26, whereinthe handheld device further comprises a display.

Example 28 is directed to the ultrasound device of example 26, whereinthe handheld device further comprises a touchscreen.

Example 29 is directed to the ultrasound device of example 1, whereinthe ultrasound probe comprises a patch configured to be affixed to asubject.

Example 30 is directed to a skin-mountable ultrasound patch, comprising:a monolithic ultrasound chip including a semiconductor die, and aplurality of ultrasonic transducers integrated on the semiconductor die,at least one of the plurality of ultrasonic transducers configured tooperate in a first mode associated with a first frequency range and asecond mode associated with a second frequency range, wherein the firstfrequency range is at least partially non-overlapping with the secondfrequency range; and a dressing configured to receive and retain theultrasound chip, the dressing further configured to couple to apatient's body.

Example 31 is directed to the ultrasound patch of example 30, whereinthe monolithic ultrasound chip further comprises a control circuitryconfigured to control the plurality of ultrasonic transducers togenerate and/or detect ultrasound signals having frequencies in thefirst frequency range, in response to receiving an indication to operatethe ultrasound probe in the first mode; and to control the plurality ofultrasonic transducers to generate and/or detect ultrasound signalshaving frequencies in the second frequency range, in response toreceiving an indication to operate the ultrasound probe in the secondmode.

Example 32 is directed to the ultrasound patch of example 31, whereinthe control circuitry defines a CMOS circuitry.

Example 33 is directed to the ultrasound patch of example 30, whereinthe dressing further comprises an adhesive layer to couple the patch tothe patient's body.

Example 34 is directed to the ultrasound patch of example 30, furthercomprising a housing to receive the monolithic ultrasound chip, thehousing having an upper portion and a lower portion, wherein the lowerhousing portion further comprises an aperture to expose the ultrasonictransducers to the subject's body.

Example 35 is directed to the ultrasound patch of example 30, furthercomprising a communication platform to communicate ultrasound signals toand from the ultrasound chip.

Example 36 is directed to the ultrasound patch of example 30, furthercomprising a circuit board to receive the ultrasound chip.

Example 37 is directed to the ultrasound patch of example 30, furthercomprising a communication platform to communicate with an externalcommunication device.

Example 38 is directed to the ultrasound patch of example 37, whereinthe communication platform is selected from the group consisting ofNear-Field Communication (NFC), Bluetooth (BT), Bluetooth Low Energy(BLE) and Wi-Fi.

Example 39 is directed to a wearable ultrasound device, comprising: aultrasound chip including an array of ultrasonic transducers, eachultrasonic transducer defining a capacitive micro-machined ultrasonictransducer (CMUT) operable to transceive signals; and a dressingconfigured to receive and retain the ultrasound chip, the dressingfurther configured to couple to a subject body; wherein the array ofultrasonic transducers further comprises a first plurality of CMUTsconfigured to operate in a collapse mode and a second plurality of CMUTsconfigured to operation in a non-collapse mode.

Example 40 is directed to the wearable ultrasound device of example 39,wherein the ultrasound chip further comprises a control circuitryconfigured to control the plurality of ultrasonic transducers togenerate and/or detect ultrasound signals having frequencies in thefirst frequency range, in response to receiving an indication to operatethe ultrasound probe in the first mode; and to control the plurality ofultrasonic transducers to generate and/or detect ultrasound signalshaving frequencies in the second frequency range, in response toreceiving an indication to operate the ultrasound probe in the secondmode.

Example 41 is directed to the wearable ultrasound device of example 40,wherein the ultrasound chip defines a solid-state device.

Example 42 is directed to the wearable ultrasound device of example 39,wherein the ultrasonic transducer is configured to generate a firstfrequency band when operated at collapse mode and to generate a secondfrequency band when operated at non-collapse mode.

Example 43 is directed to the wearable ultrasound device of example 39,wherein the ultrasound chip is configured to switch between collapse andnon-collapse modes of operation.

Example 44 is directed to the wearable ultrasound device of example 39,further comprising a communication platform to communicate with anexternal communication device.

Example 45 is directed to the wearable ultrasound device of example 44,wherein the communication platform is selected from the group consistingof Near-Field Communication (NFC), Bluetooth (BT), Bluetooth Low Energy(BLE) and Wi-Fi.

Example 46 is directed to the wearable ultra-sound device of example 45,wherein the communication platform receives imaging instructions from anauxiliary device and transmits one or more ultrasound images to theauxiliary device in response to the received instructions.

Example 47 is directed to the wearable ultrasound device of example 39,wherein the dressing further comprises an opening to accommodate anoptical lens adjacent the array of ultrasonic transducers.

According to some aspects of the present application, a system isprovided, comprising: a multi-modal ultrasound probe configured tooperate in a plurality of operating modes associated with a respectiveplurality of configuration profiles; and a computing device coupled tothe multi-modal ultrasound probe and configured to, in response toreceiving input indicating an operating mode selected by a user, causethe multi-modal ultrasound probe to operate in the selected operatingmode.

In some embodiments, the plurality of operating modes includes a firstoperating mode associated with a first configuration profile specifyinga first set of parameter values and a second operating mode associatedwith a second configuration profile specifying a second set of parametervalues different from the first set of parameter values.

In some such embodiments, the computing device causes the multi-modalultrasound probe to operate in a selected operating mode by providing anindication of the selected operating mode to the multi-modal ultrasoundprobe.

In some such embodiments, the multi-modal ultrasound probe comprises aplurality of ultrasonic transducers and control circuitry configured to:responsive to receiving an indication of the first operating mode fromthe computing device, obtain a first configuration profile specifying afirst set of parameter values associated with the first operating mode;and control, using the first configuration profile, the ultrasounddevice to operate in the first operating mode, and responsive toreceiving an indication of the second operating mode from the computingdevice, obtain a second configuration profile specifying a second set ofparameter values associated with the second operating mode, the secondset of parameter values being different from the first set of parametervalues; and control, using the second configuration profile, theultrasound device to operate in the second operating mode.

In some such embodiments, the first set of parameter values specifies afirst azimuth aperture value and the second set of parameter valuesspecifies a second azimuth aperture value different from the firstazimuth aperture value, and the control circuitry is configured tocontrol the plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by using the first azimuth aperturevalue and to operate in the second operating mode at least in part byusing the second azimuth aperture value.

In some such embodiments, the first set of parameter values specifies afirst elevation aperture value and the second set of parameter valuesspecifies a second elevation aperture value different from the firstelevation aperture value, and the control circuitry is configured tocontrol the plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by using the first elevation aperturevalue and to operate in the second operating mode at least in part byusing the second elevation aperture value.

In some such embodiments, the first set of parameter values specifies afirst azimuth focus value and the second set of parameter valuesspecifies a second azimuth focus value different from the first azimuthfocus value, and the control circuitry is configured to control theplurality of ultrasonic transducers to operate in the first operatingmode at least in part by using the first azimuth focus value and tooperate in the second operating mode at least in part by using thesecond azimuth focus value.

In some such embodiments, the first set of parameter values specifies afirst elevation focus value and the second set of parameter valuesspecifies a second elevation focus value different from the firstelevation focus value, and the control circuitry is configured tocontrol the plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by using the first elevation focus valueand to operate in the second operating mode at least in part by usingthe second elevation focus value.

In some such embodiments, the first set of parameter values specifies afirst bias voltage value for at least one of the plurality of ultrasonictransducers and the second set of parameter values specifies a secondbias voltage value for the at least one of the plurality of ultrasonictransducers, the second bias voltage value being different from thefirst bias voltage focus value, and the control circuitry is configuredto control the plurality of ultrasonic transducers to operate in thefirst operating mode at least in part by using the first bias voltagevalue and to operate in the second operating mode at least in part byusing the second bias voltage value.

In some such embodiments, the first set of parameter values specifies afirst transmit peak-to-peak voltage value and the second set ofparameter values specifies a second transmit peak-to-peak voltage valuedifferent from the first transmit peak-to-peak voltage focus value, andthe control circuitry is configured to control the plurality ofultrasonic transducers to operate in the first operating mode at leastin part by using the first transmit peak-to-peak voltage value and tooperate in the second operating mode at least in part by using thesecond transmit peak-to-peak voltage value.

In some such embodiments, the first set of parameter values specifies afirst transmit center frequency value and the second set of parametervalues specifies a second transmit center frequency value different fromthe first transmit center frequency value, and the control circuitry isconfigured to control the plurality of ultrasonic transducers to operatein the first operating mode at least in part by using the first transmitcenter frequency value and to operate in the second operating mode atleast in part by using the second transmit center frequency value.

In some such embodiments, the first set of parameter values specifies afirst receive center frequency value and the second set of parametervalues specifies a second receive center frequency value different fromthe first receive center frequency value, and the control circuitry isconfigured to control the plurality of ultrasonic transducers to operatein the first operating mode at least in part by using the first receivecenter frequency value and to operate in the second operating mode atleast in part by using the second receive center frequency value.

In some such embodiments, the first set of parameter values specifies afirst polarity value and the second set of parameter values specifies asecond polarity value different from the first polarity value, and thecontrol circuitry is configured to control the plurality of ultrasonictransducers to operate in the first operating mode at least in part byusing the first polarity value and to operate in the second operatingmode at least in part by using the second polarity value.

In some such embodiments, the hand-held ultrasound probe furthercomprises an analog-to-digital converter (ADC), the first set ofparameter values specifies a first ADC clock rate value and the secondset of parameter values specifies a second ADC clock rate valuedifferent from the first ADC clock rate value, and the control circuitryis configured to control the plurality of ultrasonic transducers tooperate in the first operating mode at least in part by operating theADC at the first ADC clock rate value and to operate in the secondoperating mode at least in part by operating the ADC at the second ADCclock rate value.

In some such embodiments, the first set of parameter values specifies afirst decimation rate value and the second set of parameter valuesspecifies a second decimation rate value different from the firstdecimation rate value, and the control circuitry is configured tocontrol the plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by using the first decimation rate valueand to operate in the second operating mode at least in part by usingthe second decimation rate value.

In some such embodiments, the first set of parameter values specifies afirst receive duration value and the second set of parameter valuesspecifies a second receive value different from the first receiveduration value, and the control circuitry is configured to control theplurality of ultrasonic transducers to operate in the first operatingmode at least in part by using the first receive duration value and tooperate in the second operating mode at least in part by using thesecond receive duration value.

In some embodiments, the multi-modal ultrasound probe is a hand-heldultrasound probe.

In some embodiments, the computing device is a mobile computing device.

According to some aspects of the present application a method isprovided for controlling operation of a multi-modal ultrasound probeconfigured to operate in a plurality of operating modes associated witha respective plurality of configuration profiles, the method comprising:receiving, at a computing device, input indicating an operating modeselected by a user; and causing the multi-modal ultrasound probe tooperate in the selected operating mode using parameter values specifiedby a configuration profile associated with the selected operating mode.

According to some aspects of the present application a system isprovided, comprising: an ultrasound device, comprising: a plurality ofultrasonic transducers, and control circuitry; and a computing devicehaving at least one computer hardware processor and at least one memory,the computing device communicatively coupled to a display and to theultrasound device, the at least one computer hardware processorconfigured to: present, via the display, a graphical user interface(GUI) showing a plurality of GUI elements representing a respectiveplurality of operating modes for the ultrasound device, the plurality ofoperating modes comprising first and second operating modes; responsiveto receiving, via the GUI, input indicating selection of either thefirst operating mode or the second operating mode, provide an indicationof the selected operating mode to the ultrasound device, wherein thecontrol circuitry is configured to: responsive to receiving anindication of the first operating mode, obtain a first configurationprofile specifying a first set of parameter values associated with thefirst operating mode; and control, using the first configurationprofile, the ultrasound device to operate in the first operating mode,and responsive to receiving an indication of the second operating mode,obtain a second configuration profile specifying a second set ofparameter values associated with the second operating mode, the secondset of parameter values being different from the first set of parametervalues; and control, using the second configuration profile, theultrasound device to operate in the second operating mode.

In some embodiments, the first set of parameter values specifies a firstazimuth aperture value and the second set of parameter values specifiesa second azimuth aperture value different from the first azimuthaperture value, and the control circuitry is configured to control theplurality of ultrasonic transducers to operate in the first operatingmode at least in part by using the first azimuth aperture value and tooperate in the second operating mode at least in part by using thesecond azimuth aperture value.

In some embodiments, the first set of parameter values specifies a firstelevation aperture value and the second set of parameter valuesspecifies a second elevation aperture value different from the firstelevation aperture value, and the control circuitry is configured tocontrol the plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by using the first elevation aperturevalue and to operate in the second operating mode at least in part byusing the second elevation aperture value.

In some embodiments, the first set of parameter values specifies a firstazimuth focus value and the second set of parameter values specifies asecond azimuth focus value different from the first azimuth focus value,and the control circuitry is configured to control the plurality ofultrasonic transducers to operate in the first operating mode at leastin part by using the first azimuth focus value and to operate in thesecond operating mode at least in part by using the second azimuth focusvalue.

In some embodiments, the first set of parameter values specifies a firstelevation focus value and the second set of parameter values specifies asecond elevation focus value different from the first elevation focusvalue, and the control circuitry is configured to control the pluralityof ultrasonic transducers to operate in the first operating mode atleast in part by using the first elevation focus value and to operate inthe second operating mode at least in part by using the second elevationfocus value.

In some embodiments, the first set of parameter values specifies a firstbias voltage value for at least one of the plurality of ultrasonictransducers and the second set of parameter values specifies a secondbias voltage value for the at least one of the plurality of ultrasonictransducers, the second bias voltage value being different from thefirst bias voltage focus value, and the control circuitry is configuredto control the plurality of ultrasonic transducers to operate in thefirst operating mode at least in part by using the first bias voltagevalue and to operate in the second operating mode at least in part byusing the second bias voltage value.

In some embodiments, the first set of parameter values specifies a firsttransmit peak-to-peak voltage value and the second set of parametervalues specifies a second transmit peak-to-peak voltage value differentfrom the first transmit peak-to-peak voltage focus value, and thecontrol circuitry is configured to control the plurality of ultrasonictransducers to operate in the first operating mode at least in part byusing the first transmit peak-to-peak voltage value and to operate inthe second operating mode at least in part by using the second transmitpeak-to-peak voltage value.

In some embodiments, the first set of parameter values specifies a firsttransmit center frequency value and the second set of parameter valuesspecifies a second transmit center frequency value different from thefirst transmit center frequency value, and the control circuitry isconfigured to control the plurality of ultrasonic transducers to operatein the first operating mode at least in part by using the first transmitcenter frequency value and to operate in the second operating mode atleast in part by using the second transmit center frequency value.

In some such embodiments, a difference between the first and secondcenter frequency values is at least 1 MHz.

In some such embodiments, the difference is at least 2 MHz.

In some such embodiments, the difference is between 5 MHz and 10 MHz.

In some such embodiments, the first center frequency value is within 1-5MHz and the second center frequency value is within 5-9 MHz.

In some such embodiments, the first center frequency value is within 2-4MHz and the second center frequency value is within 6-8 MHz.

In some such embodiments, the first center frequency value is within 6-8MHz and the second center frequency value is within 12-15 MHz.

In some embodiments, the first set of parameter values specifies a firstreceive center frequency value and the second set of parameter valuesspecifies a second receive center frequency value different from thefirst receive center frequency value, and the control circuitry isconfigured to control the plurality of ultrasonic transducers to operatein the first operating mode at least in part by using the first receivecenter frequency value and to operate in the second operating mode atleast in part by using the second receive center frequency value.

In some such embodiments, the first set of parameter values furtherspecifies a first transmit center frequency value that is equal to thefirst receive center frequency value.

In some such embodiments, the first set of parameter values furtherspecifies a first transmit center frequency value that is not equal tothe first receive center frequency value.

In some such embodiments, the first receive center frequency value is amultiple of the first transmit frequency value.

In some such embodiments, the first receive center frequency value isapproximately two times the first transmit frequency value.

In some embodiments, the first set of parameter values specifies a firstpolarity value and the second set of parameter values specifies a secondpolarity value different from the first polarity value, and the controlcircuitry is configured to control the plurality of ultrasonictransducers to operate in the first operating mode at least in part byusing the first polarity value and to operate in the second operatingmode at least in part by using the second polarity value.

In some embodiments, the ultrasound device further comprises ananalog-to-digital converter (ADC), the first set of parameter valuesspecifies a first ADC clock rate value and the second set of parametervalues specifies a second ADC clock rate value different from the firstADC clock rate value, and the control circuitry is configured to controlthe plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by operating the ADC at the first ADCclock rate value and to operate in the second operating mode at least inpart by operating the ADC at the second ADC clock rate value.

In some embodiments, the first set of parameter values specifies a firstdecimation rate value and the second set of parameter values specifies asecond decimation rate value different from the first decimation ratevalue, and the control circuitry is configured to control the pluralityof ultrasonic transducers to operate in the first operating mode atleast in part by using the first decimation rate value and to operate inthe second operating mode at least in part by using the seconddecimation rate value.

In some embodiments, the first set of parameter values specifies a firstreceive duration value and the second set of parameter values specifiesa second receive value different from the first receive duration value,and the control circuitry is configured to control the plurality ofultrasonic transducers to operate in the first operating mode at leastin part by using the first receive duration value and to operate in thesecond operating mode at least in part by using the second receiveduration value.

In some embodiments, the plurality of GUI elements comprises GUIelements representing at least two of: an operating mode for cardiacimaging, an operating mode for abdominal imaging, an operating mode forsmall parts imaging, an operating mode for lung imaging, an operatingmode for ocular imaging, an operating mode for vascular imaging, anoperating mode for 3D imaging, an operating mode for shear imaging, oran operating mode for Doppler imaging.

In some embodiments, the display is a touch screen, and the computingdevice is configured to receive the input indicating the selection viathe touch screen.

In some embodiments, the control circuitry is configured to obtain thefirst configuration profile by receiving it from the computing device.

In some embodiments, the control circuitry is configured to obtain thefirst configuration profile by accessing it in a memory of theultrasound device.

In some embodiments, the control circuitry is configured to operate theultrasound device in the first operating mode and provide, to thecomputing device, data obtained through operation of the ultrasounddevice in the first operating mode.

In some such embodiments, the at least one computer hardware processoris configured to: generate an ultrasound image from the data; anddisplay the ultrasound image via the display.

In some embodiments, the computing device comprises the display.

In some embodiments, the computing device is a mobile device.

In some embodiments, the computing device is a smartphone.

In some embodiments, the ultrasound device is a handheld ultrasoundprobe.

In some embodiments, wherein the ultrasound device is a wearableultrasound device.

In some embodiments, the plurality of ultrasonic transducers includes aplurality of metal oxide semiconductor (MOS) ultrasonic transducers.

In some embodiments, the plurality of MOS ultrasonic transducersincludes a first MOS ultrasonic transducer including a cavity formed ina MOS wafer, with a membrane overlying and sealing the cavity.

In some embodiments, the plurality of ultrasonic transducers includes aplurality of micromachined ultrasonic transducers.

In some embodiments, the plurality of ultrasonic transducers includes aplurality of capacitive micromachined ultrasonic transducers.

In some embodiments, the plurality of ultrasonic transducers includes aplurality of piezoelectric ultrasonic transducers.

In some embodiments, the plurality of ultrasonic transducers comprisesbetween 5000 and 15000 ultrasonic transducers arranged in atwo-dimensional arrangement.

According to some aspects of the present application a method isprovided, comprising: receiving, via a graphical user interface, aselection of an operating mode for an ultrasound device configured tooperate in a plurality of modes including a first operating mode and asecond operating mode; responsive to receiving a selection of a firstoperating mode, obtaining a first configuration profile specifying afirst set of parameter values associated with the first operating mode;and controlling, using the first configuration profile, the ultrasounddevice to operate in the first operating mode, and responsive toreceiving a selection of the second operating mode, obtaining a secondconfiguration profile specifying a second set of parameter valuesassociated with the second operating mode, the second set of parametervalues being different from the first set of parameter values; andcontrolling, using the second configuration profile, the ultrasounddevice to operate in the second operating mode.

According to some aspects of the present application a handheldmulti-modal ultrasound probe is provided, configured to operate in aplurality of operating modes associated with a respective plurality ofconfiguration profiles, the handheld ultrasound probe comprising: aplurality of ultrasonic transducers; and control circuitry configuredto: receive an indication of a selected operating mode; access aconfiguration profile associated with the selected operating mode; andcontrol, using parameter values specified in the accessed configurationprofile, the handheld multi-modal ultrasound probe to operate in theselected operating mode.

According to some aspects of the present application an ultrasounddevice is provided, capable of operating in a plurality of operatingmodes including a first operating mode and a second operating mode, theultrasound device comprising: a plurality of ultrasonic transducers, andcontrol circuitry configured to: receive an indication of a selectedoperating mode; responsive to determining that the selecting operatingmode is the first operating mode, obtain a first configuration profilespecifying a first set of parameter values associated with the firstoperating mode; and control, using the first configuration profile, theultrasound device to operate in the first operating mode, and responsiveto receiving an indication of the second operating mode, responsive todetermining that the selecting operating mode is the second operatingmode, obtain a second configuration profile specifying a second set ofparameter values associated with the second operating mode, the secondset of parameter values being different from the first set of parametervalues; and control, using the second configuration profile, theultrasound device to operate in the second operating mode.

In some embodiments, the ultrasound device comprises a mechanicalcontrol mechanism for selecting an operating mode among the plurality ofoperating modes.

In some embodiments, the ultrasound device comprises a display and theultrasound device is configured to generate a graphical user interface(GUI) for selecting an operating mode among the plurality of modes andpresent the generated GUI through the display.

In some embodiments, the first set of parameter values specifies a firstazimuth aperture value and the second set of parameter values specifiesa second azimuth aperture value different from the first azimuthaperture value, and the control circuitry is configured to control theplurality of ultrasonic transducers to operate in the first operatingmode at least in part by using the first azimuth aperture value and tooperate in the second operating mode at least in part by using thesecond azimuth aperture value.

In some embodiments, the first set of parameter values specifies a firstelevation aperture value and the second set of parameter valuesspecifies a second elevation aperture value different from the firstelevation aperture value, and the control circuitry is configured tocontrol the plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by using the first elevation aperturevalue and to operate in the second operating mode at least in part byusing the second elevation aperture value.

In some embodiments, the first set of parameter values specifies a firstazimuth focus value and the second set of parameter values specifies asecond azimuth focus value different from the first azimuth focus value,and the control circuitry is configured to control the plurality ofultrasonic transducers to operate in the first operating mode at leastin part by using the first azimuth focus value and to operate in thesecond operating mode at least in part by using the second azimuth focusvalue.

In some embodiments, the first set of parameter values specifies a firstelevation focus value and the second set of parameter values specifies asecond elevation focus value different from the first elevation focusvalue, and the control circuitry is configured to control the pluralityof ultrasonic transducers to operate in the first operating mode atleast in part by using the first elevation focus value and to operate inthe second operating mode at least in part by using the second elevationfocus value.

In some embodiments, the first set of parameter values specifies a firstbias voltage value for at least one of the plurality of ultrasonictransducers and the second set of parameter values specifies a secondbias voltage value for the at least one of the plurality of ultrasonictransducers, the second bias voltage value being different from thefirst bias voltage focus value, and the control circuitry is configuredto control the plurality of ultrasonic transducers to operate in thefirst operating mode at least in part by using the first bias voltagevalue and to operate in the second operating mode at least in part byusing the second bias voltage value.

In some embodiments, the first set of parameter values specifies a firsttransmit peak-to-peak voltage value and the second set of parametervalues specifies a second transmit peak-to-peak voltage value differentfrom the first transmit peak-to-peak voltage focus value, and thecontrol circuitry is configured to control the plurality of ultrasonictransducers to operate in the first operating mode at least in part byusing the first transmit peak-to-peak voltage value and to operate inthe second operating mode at least in part by using the second transmitpeak-to-peak voltage value.

In some embodiments, the first set of parameter values specifies a firsttransmit center frequency value and the second set of parameter valuesspecifies a second transmit center frequency value different from thefirst transmit center frequency value, and the control circuitry isconfigured to control the plurality of ultrasonic transducers to operatein the first operating mode at least in part by using the first transmitcenter frequency value and to operate in the second operating mode atleast in part by using the second transmit center frequency value.

In some embodiments, the first set of parameter values specifies a firstreceive center frequency value and the second set of parameter valuesspecifies a second receive center frequency value different from thefirst receive center frequency value, and the control circuitry isconfigured to control the plurality of ultrasonic transducers to operatein the first operating mode at least in part by using the first receivecenter frequency value and to operate in the second operating mode atleast in part by using the second receive center frequency value.

In some embodiments, the first set of parameter values specifies a firstpolarity value and the second set of parameter values specifies a secondpolarity value different from the first polarity value, and the controlcircuitry is configured to control the plurality of ultrasonictransducers to operate in the first operating mode at least in part byusing the first polarity value and to operate in the second operatingmode at least in part by using the second polarity value.

In some embodiments, the ultrasound device comprises ananalog-to-digital converter (ADC), the first set of parameter valuesspecifies a first ADC clock rate value and the second set of parametervalues specifies a second ADC clock rate value different from the firstADC clock rate value, and the control circuitry is configured to controlthe plurality of ultrasonic transducers to operate in the firstoperating mode at least in part by operating the ADC at the first ADCclock rate value and to operate in the second operating mode at least inpart by operating the ADC at the second ADC clock rate value.

In some embodiments, the first set of parameter values specifies a firstdecimation rate value and the second set of parameter values specifies asecond decimation rate value different from the first decimation ratevalue, and the control circuitry is configure to control the pluralityof ultrasonic transducers to operate in the first operating mode atleast in part by using the first decimation rate value and to operate inthe second operating mode at least in part by using the seconddecimation rate value.

In some embodiments, the first set of parameter values specifies a firstreceive duration value and the second set of parameter values specifiesa second receive value different from the first receive duration value,and the control circuitry is configured to control the plurality ofultrasonic transducers to operate in the first operating mode at leastin part by using the first receive duration value and to operate in thesecond operating mode at least in part by using the second receiveduration value.

In some embodiments, the plurality of operating modes comprises anoperating mode for cardiac imaging, an operating mode for abdominalimaging, an operating mode for small parts imaging, an operating modefor lung imaging, and an operating model for ocular imaging.

In some embodiments, the ultrasound device is a handheld ultrasoundprobe.

In some embodiments, the ultrasound device is a wearable ultrasounddevice.

In some embodiments, the plurality of ultrasonic transducers includes aplurality metal oxide semiconductor (MOS) ultrasonic transducers.

In some embodiments, the plurality of ultrasonic transducers includes aplurality of capacitive micromachined ultrasonic transducers.

According to some aspects of the present application a mobile computingdevice is provided, communicatively coupled to an ultrasound device, themobile computing device comprising: at least one computer hardwareprocessor; a display; and at least one non-transitory computer-readablestorage medium storing an application program that, when executed by theat least one computer hardware processor causes the at least onecomputer hardware processor to: generate a graphical user interface(GUI) having a plurality of GUI elements representing a respectiveplurality of operating modes for the multi-modal ultrasound device;present the GUI via the display; receive, via the GUI, user inputindicating selection of one of the plurality of operating modes; andprovide an indication of the selected operating mode to the ultrasounddevice.

In some embodiments, the plurality of GUI elements comprises a GUIelement representing an operating mode for cardiac imaging, an operatingmode for abdominal imaging, an operating mode for small parts imaging,an operating mode for lung imaging, and an operating model for ocularimaging.

In some embodiments, the display is a touchscreen, and the mobilecomputing device is configured to receive the user input indicating theselection via the touchscreen.

In some embodiments, the at least one computer hardware processor isfurther configured to: receive data obtained by the ultrasound deviceduring operation in the selected operating mode; generate at least oneultrasound image from the data; and display the at least one generatedultrasound image via the display.

What is claimed is:
 1. An ultrasound sensor, comprising a substrate, a plurality of circular or square ultrasonic transducers on the substrate; a membrane configured to vibrate in response to a changing voltage differential applied to the ultrasonic transducers, the membrane having a thickness of less than or equal to 5 microns and at least partially bounding at least one of the plurality of ultrasonic transducers.
 2. The ultrasound sensor of claim 1, further comprising control circuitry on the substrate configured to apply a peak-to-peak AC voltage in a range of 16-41 V to the plurality of ultrasonic transducers.
 3. The ultrasound sensor of claim 1, wherein the plurality of ultrasonic transducers are configured to operate in a frequency range of 1-15 MHz.
 4. The ultrasound sensor of claim 1, wherein the plurality of ultrasonic transducers form an array.
 5. The ultrasound sensor of claim 4, wherein the array has a pitch of about 52 microns.
 6. The ultrasound sensor of claim 1, wherein at least one of the plurality of ultrasonic transducers is configured to operate in a collapsed mode and at least one of the plurality of ultrasonic transducers is configured to operate in a non-collapsed mode.
 7. The ultrasound sensor of claim 1, wherein: the plurality of ultrasonic transducers are configured to detect ultrasound signals having frequencies in a first frequency range, at a first depth relative to a subject; the plurality of ultrasonic transducers are configured to detect ultrasound signals having frequencies in a second frequency range, at a second depth relative to the subject; and the first depth is smaller than the second depth.
 8. The ultrasound sensor of claim 1, wherein the plurality of ultrasonic transducers are configured to receive a bias voltage in the range of 30-110 Volts.
 9. The ultrasound sensor of claim 1, wherein the plurality of ultrasonic transducers comprise capacitive micromachined ultrasonic transducers (CMUTs).
 10. The ultrasound sensor of claim 1, wherein the plurality of ultrasonic transducers comprise CMOS ultrasonic transducers (CUTs).
 11. The ultrasound sensor of claim 1, wherein: the plurality of ultrasonic transducers comprise a plurality of ultrasonic transducer cavities; the substrate is a first substrate and comprises a first thermal oxide layer; and the ultrasound sensor further comprises a second substrate comprising a second thermal oxide layer, bonded to the first thermal oxide layer, defining an oxide-to-oxide bond; and the plurality of ultrasonic transducer cavities are formed between the first and second substrates.
 12. The ultrasound sensor of claim 1, wherein the membrane has a thickness of less than or equal to 2 microns. 